Core Architecture

• Device Family: QPro Virtex 2.5V Radiation-Hardened FPGAs
• Part Number: XQVR1000-2CG560V
• System Gates: 1,124,022
• Logic Cells: 27,648
• CLB Array: 64 x 96
• Maximum User I/O: 404 pins
• Block RAM: 131,072 bits
• SelectRAM: 393,216 bits

Package Details

• Package Type: CG560 (560-column Ceramic Column Grid)
• Package Size: High-density ceramic column grid array
• Lead Finish: Solder column connections
• Pin Count: 560 total pins

Electrical Characteristics

• Supply Voltage (VCCINT): 2.5V 簣5%
• I/O Supply Voltage (VCCO): 1.2V to 3.6V
• Operating Temperature: -55簞C to +125簞C
• Speed Grade: -2 (optimized for reliability)
• Process Technology: 0.22 繕m 5-layer metal CMOS

Radiation Specifications

• Total Ionizing Dose: Guaranteed to 100K Rad(si)
• Latch-up Immunity: LET = 125 MeV cm簡/mg
• SEU Protection: Achievable with recommended redundancy implementation

Performance Characteristics

• System Performance: Up to 200 MHz
• Global Clock Distribution: 4 primary + 24 secondary nets
• Delay-Locked Loops: 4 dedicated DLLs
• Multi-Standard I/O: 16 interface standards supported
• Memory Architecture: Hierarchical with configurable RAMs

2. Pricing Information

Current Market Pricing (2025):

• Unit Price: Contact authorized distributors for current pricing
• Volume Pricing: Available for quantities of 100+ units
• Historical Reference: Similar XQVR1000 devices were priced at approximately $12,000 for 100-piece quantities in military applications

Pricing Notes:

• Pricing varies based on order quantity, delivery requirements, and specific grade selections
• Extended temperature range and QML certification affect final pricing
• Long-term supply agreements available for production programs

3. Documents & Media

Technical Documentation

• Official Datasheet: QPro Virtex 2.5V QML High-Reliability FPGAs (DS002)
• User Guide: Virtex 2.5V Platform FPGA Complete Data Sheet
• Application Notes: Radiation-hardened design guidelines
• Package Information: CG560 package specifications and pin assignments
• Quality Documentation: QML certification reports

Design Resources

• Pinout Files: Available in multiple CAD formats
• IBIS Models: For signal integrity analysis
• Timing Models: Static timing analysis support
• Reference Designs: Space-qualified application examples

Software Support

• Development Tools: Xilinx ISE Design Suite compatibility
• Programming Support: Multiple configuration modes
• Simulation Models: VHDL/Verilog behavioral models

4. Related Resources

Development Tools

• Xilinx ISE Design Suite: Complete FPGA development environment
• Static Timing Analyzer (TRCE): Precision timing verification
• ChipScope Pro: Integrated logic analyzer capability
• System Generator: DSP design tools integration

Application Areas

• Satellite Systems: Payload processing and control
• Space Missions: Deep space exploration programs
• Defense Systems: Radar and communication applications
• Nuclear Environments: High-radiation industrial applications
• Avionics: Flight-critical system implementations

Compatible Products

• Memory Interfaces: Direct ZBTRAM connectivity
• Clock Management: External oscillator and PLL support
• I/O Standards: LVTTL, LVCMOS, GTL, HSTL, SSTL compatibility
• Development Boards: Space-qualified evaluation platforms

Technical Support

• Application Engineering: Dedicated aerospace/defense support team
• Training Programs: Radiation-hardened design methodology
• Design Reviews: Pre-flight hardware verification services
• Long-term Support: Extended product lifecycle management

5. Environmental & Export Classifications

Environmental Certifications

• MIL-PRF-38535: Qualified Manufacturer Listing (QML) certified
• Radiation Hardness: Space-level radiation tolerance verified
• Temperature Qualification: Full military temperature range testing
• Vibration/Shock: Aerospace launch environment qualified
• Thermal Cycling: Extended reliability validation

Quality Standards

• Class Q (QML): Highest reliability grade available
• 100% Testing: Full functional and parametric verification
• Traceability: Complete lot genealogy and test records
• Statistical Process Control: Six Sigma manufacturing processes

Export Control Information

• ECCN Classification: Subject to U.S. Export Administration Regulations
• ITAR Considerations: May require export license for certain applications
• International Compliance: Meets applicable international standards
• Documentation: Export compliance certificates available

Packaging & Handling

• ESD Sensitivity: Class 1 handling requirements
• Moisture Sensitivity: MSL-3 classification
• Storage Requirements: Controlled temperature/humidity environment
• Lead-Free Status: RoHS compliant options available

Logistics Information

• Manufacturing Location: Qualified aerospace facility
• Lead Times: Extended for space-grade qualification
• Minimum Order Quantities: Application-specific requirements
• Delivery Options: Expedited shipping for critical programs

Contact Information: For technical support, pricing, and availability information for the XQVR1000-2CG560V, contact your authorized Xilinx distributor or visit the official AMD/Xilinx aerospace and defense product portal.

This product is designed for professional use in aerospace and defense applications. Proper handling and implementation expertise is required for optimal performance and reliability.

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