³Ô¹Ïtv / ENGINEERING EXPLANATIONSolder Mask Thickness Uniformity / release checkpoints1Reference surfaceRecord copper-top, base-material or edge location with every thickness result.2Support mapCompare repeatable patterns with fixture and printing direction where applicable.3Individual readingsRetain locations and values; do not substitute the average for a local minimum.4Process scopeDistinguish application from later drying, imaging, development and cure effects.Conceptual illustration. Not to scale; examples are not process settings or acceptance limits.