³Ô¹Ïtv / ENGINEERING EXPLANATIONReview sequence: PCBA Bottom Fill Process1Before fillComplete the agreed joint and electrical checks.2VolumeUse assembled gap and justified occupiedfraction.3ProcessObtain material-specific dispense and cureguidance.4VerificationExternal fillet appearance does not proveinternal coverage.Illustrative geometry only. Not to scale, a production setting or evidence of qualification.