³Ô¹Ïtv / ENGINEERING EXPLANATIONReview sequence: Chip on Board Assembly1DiePreserve die identity, pad map and handlingrequirements.2InterfaceVerify finish and material compatibility for theactual route.3VolumeThe geometric model does not set allowablevoiding.4EvidenceConfirm process feasibility and inspection beforecommitment.Illustrative geometry only. Not to scale, a production setting or evidence of qualification.