³Ô¹Ïtv / ENGINEERING EXPLANATIONReview sequence: Chip Package Soldering Process1RoutePackage terminal form determines the attachmentdiscussion.2ProfileUse measured locations, not only oven zonesettings.3RateA two-point slope does not approve a completeprofile.4SequenceInspect before later operations conceal theinterface.Illustrative geometry only. Not to scale, a production setting or evidence of qualification.