³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: BGA Reballing1EligibilityReuse permission, exact identity and knownexposure history.2ArrayPackage-specific population, diameter, alloy andtooling.3ConditionPads, package body and any unresolved internaldamage.4ReleaseRestored-array inspection plus the agreedelectrical evidence.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.