³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: BGA Solder-Joint Quality Control1RequirementsExact package, revision and agreed acceptancebasis.2ProcessMaterials, printing, placement and measured heathistory.3CoverageOptical, X-ray, electrical and functional limitsidentified.4MetricsFirst-pass before repair; consistent opportunitiesand counting.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.