³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: PCB Soldering1HandLocal access, tip geometry, operator instructionand joint inspection.2ReflowPaste deposition, placement, product profile andhidden-joint evidence.3WaveFlux delivery, thermal preparation, carrier accessand solder contact.4SelectiveNozzle clearance, fixture, local profile andprogrammed path.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.