³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: PTH Solder Fill1GeometryFinished hole, lead cross-section, board heightand eccentricity.2HeatProduct preheat, copper connection and actualjoint exposure.3AccessFlux penetration, fixture opening and soldercontact.4EvidenceMethod, specimen, filled height and contract-specific criterion.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.