³Ô¹Ïtv / SOLDERING ENGINEERINGMeasurement worksheet: Relative BGA separation change01Initial separation · mmUse the actual measured geometry and onereference basis.02Signed package movement · mmPositive away from the board on the sameglobal axis.03Signed board movement · mmPositive on the same axis as package movement;subtract this term.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.