³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: BGA Reflow1GeometrySame location, direction, reference plane andtemperature.2FormationPaste deposit, placement, surface condition andthermal window.3RestrictionsExact component, board and sequence-specificlimits.4VerificationInspection and analysis matched to the suspectedhidden interface.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.