³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: Solder Skips1PatternReference designator, panel location, directionand lot.2FluxProduct, coverage, preparation and condition atsolder contact.3AccessCarrier, component shadowing, wave/nozzle andpath.4TrialSkip reduction plus bridging, damage and residuechecks.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.