³Ô¹Ïtv / SOLDERING ENGINEERINGEvidence review: Reflow Profile and Solder Defects1InputStrictly increasing sample time, Celsiustemperature and a sourced threshold.2OutputSampled peak, interpolated time above thresholdand segment-average rates.3LimitsSampling, attachment, location and materialrequirements remain explicit.4ClosureRaw data, changed settings, other locations anddefect evidence retained.Explanatory schematic. Not to scale, a process recipe, acceptance limit or inspection evidence.