³Ô¹Ïtv / FLEX ENGINEERINGModel boundary: Substrate selection evidence briefFILM + COPPER + BOND + EXPOSUREInputs describeResult does not establishManufacture, soldering, rework andservice exposure.Polymer family selected from onetemperature number.Compare exact grades and the full process history.Concept drawing / no released dimensions, factory evidence or automatic approval