³Ô¹Ïtv / ENGINEERING NOTEConstruction boundary: Bergquist vs Laird IMS PCBCircuit copperElectrical dielectricMetal baseSeparate mounting interfaceHeat sourceHeat to boundaryLAYER ROLESIMS dielectric versus separatepad or compound identified.Current exact product andrevision, not a brandplaceholder.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.