³Ô¹Ïtv / ENGINEERING NOTEConstruction boundary: Aluminum PCB Heat Dissipation DesignCircuit copperElectrical dielectricMetal baseSeparate mounting interfaceHeat sourceHeat to boundaryLAYER ROLESNamed controlled location anddownstream temperature.Section drawing with contact,gaps, fasteners and tolerances.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.