³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: Aluminum PCB Heat Dissipation Design1BoundaryNamed controlled location and downstream temperature.2MountingSection drawing with contact, gaps, fasteners and tolerances.3BudgetKnown series elements counted once; negative remainder retained.4VerificationActual installed interface and simultaneous operating losses.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.