³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: High Temperature Power PCB1MissionOperating versus storage temperature, duration and cycling.2LimitSpecific location and documented requirement, not Tg as a service rating.3AssemblyComponents, joints, adhesives, interfaces and mounting included.4EvidenceRepresentative configuration and agreed thermal/reliability acceptance.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.