³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: High Thermal Conductivity PCB Materials1Material roleIdentify the exact layer and whether electrical insulation is required.2Comparable dataSame direction, thickness, temperature and measurement boundary.3ConstructionGrade, copper, interconnect, outline and assembly route.4Commercial scopeEqual quantity and verification; unsupported substitutions remain open.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.