³Ô¹Ïtv / ENGINEERING NOTEConstruction boundary: PCB Thermal Interface MaterialsCircuit copperElectrical dielectricMetal baseSeparate mounting interfaceHeat sourceHeat to boundaryLAYER ROLESActual gap range, area,flatness and mating surfaces.Conductivity versus area-normalized impedance andincluded contacts.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.