³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: PCB Thermal Interface Materials1GeometryActual gap range, area, flatness and mating surfaces.2DataConductivity versus area-normalized impedance and included contacts.3AssemblyPressure, coverage, liners, service and repeatability.4QualificationElectrical and environmental evidence for the exact product.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.