³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: PCB Thermal Design Considerations1Operating caseOne simultaneous loss scenario, with source and unresolved items.2BoundaryLocal air, coolant or housing temperature and mounting conditions.3Controlled locationJunction, case, board or interface with a stated limit.4DeliverableRevision-controlled loss map and one specific engineering question.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.