³Ô¹Ïtv / ENGINEERING NOTEConstruction boundary: Aluminum PCB Thermal Conductivity FactorsCircuit copperElectrical dielectricMetal baseSeparate mounting interfaceHeat sourceHeat to boundaryLAYER ROLESSeparate copper, dielectric,base and mounting interface.Exact grade, direction,thickness and method recorded.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.