³Ô¹Ïtv / ENGINEERING NOTEEvidence sequence: Aluminum PCB Thermal Conductivity Factors1StackSeparate copper, dielectric, base and mounting interface.2PropertyExact grade, direction, thickness and method recorded.3GeometryConstant-area reference distinguished from real spreading.4EvidenceEquivalent heat source and downstream boundary for comparison.Conceptual drawing. Not to scale; not manufacturing or compliance evidence.