A reviewable handoff for Organic Core vs Glass Core SubstratesA reviewable handoff for Organic Core vs Glass Core SubstratesExact questionorganic core vs glass core substratesrequirement and unresolved conditionControlled inputsPackage core, interposer and receiving PCB aredifferent levels.Output boundaryFree mismatch is not bonded stress, warpage orcapability proof.Next decisionResolve open requirements before approving theconstructionWorksheet results support a discussion; they are not an accepted production record.