Choose the substrate separately from the circuit routeChoose the substrate separately from the circuit routeCeramic specificationPurity + grade + thickness + surface conditionDeposited filmsMetal stack, pattern fidelity, integrated resistor requirementsPrinted filmsCompatible paste system, firing sequence and protective layersBonded / plated copperCopper geometry, attachment method and reliability evidence³Ô¹Ïtv | Engineering schematic · not to scale · not measured evidence