QFN DFA: connect the footprint, paste and processConceptual exposed-pad segmentation. Follow the exact component drawing and application guidance before assigning coverage or stencil thickness.QFN DFA: connect the footprint, paste and processExposed-pad paste windowsSpecify window size, web and edge setback.Check each opening and the total coverage.Review via treatment and the thermal design.Then validate printing and soldering.The example illustrates segmentation; it is not a package-specific stencil recommendation.³Ô¹Ïtv engineering schematic · illustrative, not an inspection record