Mixed assembly: agree the process orderMixed assembly: agree the process order1Map pad functionsSolder lands, bond lands and retained contacts2Name the bond processWire material, ball / wedge method and access3Review actual sequenceReflow, cleaning, bonding and encapsulation4Evaluate representative padsEvidence tied to the drawing and process revision³Ô¹Ïtv · ENGINEERING SCHEMATIC · NOT PRODUCTION OR TEST EVIDENCE