Conventional insulated metal substrate versus direct thermal pathConventional IMS and direct thermal path are different constructionsConceptual sections ยท confirm the exact package pad and its electrical potentialInsulated metal substrateDirect thermal path (DTP)Heat crosses the dielectric below the thermal pad.Circuit copper remains isolated from the baseunder the specified electrical conditions.The designated thermal contact reaches the base.Other circuit features still need insulation.A live thermal pad may make the base live.Do not substitute one stackup for the other without package, isolation and manufacturing review.