Release the structure before the fabrication routeRelease the structure before the fabrication route1MapName every circuit layer, metal section and dielectric.2IsolateDefine hole types, metal clearances and intended bonds.3BuildAgree preparation, lamination, drill and plate sequence.4InspectTie section evidence and electrical tests to the drawing.³Ô¹Ïtv · ENGINEERING ILLUSTRATION · NOT A QUALIFIED CONSTRUCTION