Bond thickness must account for circuit topographyRO4000 LoPro processing guidelines: Source & Enginee…. Engineering illustration, not a production photograph or test result.Bond thickness must account for circuit topographyRO4000 LoPro processing guidelines: Source & Enginee…Before laminationProposed cured structureCopper coverage and resin fill affect the final dielectric shape.Verify the actual bond product, cured thickness and process window.