Bond thickness must account for circuit topographyRT duroid 5880 fabrication guidelines: Source & Engi…. Engineering illustration, not a production photograph or test result.Bond thickness must account for circuit topographyRT duroid 5880 fabrication guidelines: Source & Engi…Before laminationProposed cured structureCopper coverage and resin fill affect the final dielectric shape.Verify the actual bond product, cured thickness and process window.