immersion silver PCB — controlled process sequence01 Prepare copperClean and micro-etch for uniformcoverage while controlling fine-feature geometry and surfaceroughness.02 Condition the surfaceUse the approved pre-treatment tosupport a repeatable chemicaldisplacement reaction.03 Deposit silverForm the thin silver layerdirectly over exposed copper usingthe qualified chemistry.04 Rinse and protectFollow the supplier sequence,including any qualified anti-tarnish treatment; avoidincompatible residues.05 Measure and packVerify finish thickness onrepresentative features and usepackaging compatible with thereactive silver surface.06 Validate the environmentCheck solderability and relevanthumidity, sulfur, contact or RFperformance for the actualproduct.Original engineering illustration · conceptual, not to scale