³Ô¹Ïtv,Flexible PCB Manufacturing Capabilities,2026.09.17-capabilities-r3
Scope,Process references; confirm the combined construction and acceptance plan.
Page,/flex-pcb-capacity/

"Construction, laminate & stiffeners"
Parameter,Specification
Layers — flexible,1–12 layers
Layers — rigid-flex,2–32 layers
Base material,"PI / DuPont Kapton, PET, PEN; FR-4 for rigid regions or stiffeners"
Stiffeners,"FR4, aluminum, polyimide, stainless steel"
Copper thickness,1/3 oz – 2 oz
Conditions,FR-4 is used for rigid regions or stiffeners; it is not a flexible base film. Rigid-flex total layers are included for comparison with the dedicated capability page.

Finished dimensions & insulation
Parameter,Specification
Max / min board size,Minimum 0.2 × 0.3 in (5.08 × 7.62 mm); maximum 20.5 × 13 in (520.7 × 330.2 mm)
Final thickness — flexible,0.002–0.1 in (≈0.05–2.54 mm); define each region
Final thickness — rigid-flex,0.0024–0.16 in (≈0.06–4.06 mm); rigid-flex comparison range
Insulation thickness,0.5–2 mil (12.7–50.8 µm)
Conditions,"State thickness by region: flexible circuit, connector area and any locally reinforced area. The overall range does not define bend-region thickness."

Copper-dependent geometry & holes
Parameter,Specification,Application notes
Min. trace width / space,0.5 oz: 4/4 mil · 1 oz: 5/5 mil · 2 oz: 5/7 mil,
Min. annular ring,0.5 oz: 4 mil · 1 oz: 5 mil · 2 oz: 7 mil,
Min. hole size,8 mil,"Confirm drilling vs finished diameter, hole depth and material."
Hole tolerance,PTH ±3 mil · NPTH ±2 mil,
Min. slot,24 × 35 mil (0.6096 × 0.889 mm),
Conditions,"Select the row for the actual copper weight. Minimum annular ring, hole diameter and trace clearance describe different dimensions."

Coverlay & marking registration
Parameter,Specification
Solder-mask / coverlay alignment tol.,±3 mil
Silkscreen alignment tol.,±6 mil
Silkscreen line width,5 mil
Conditions,Coverlay openings and rigid-board solder mask have different fabrication steps. Mark their boundaries and tolerances separately.

Surface finish thickness
Finish,Specification
Immersion Nickel / Gold (ENIG),Nickel 100–200 µin · Gold 1–5 µin
Gold plating (electrolytic),Nickel 100–200 µin · Gold 1–4 µin
Immersion Silver,Silver 6–12 µin
Immersion Tin,Available
OSP,Film 8–20 µin
Conditions,Specify the nickel and gold layers separately. Finish thickness ranges do not imply every construction meets every IPC finish specification.

Profile tolerance & electrical test
Parameter,Specification,Application notes
Profile tolerance (punch),Accurate mould ±2 mil · Ordinary mould ±4 mil · Knife mould ±8 mil · Hand-cut ±15 mil,
Test voltage,Testing fixture: 50–300 V,Electrical-test setting; not rated operating voltage.
Conditions,"Choose the outline process on the drawing. Electrical-test voltage is a test setting, not the flex circuit’s rated operating voltage."