³Ô¹Ïtv,Metal-Core PCB Manufacturing Capabilities,2026.09.17-capabilities-r3
Scope,Process references; confirm the combined construction and acceptance plan.
Page,/metal-core-pcb-capacity/

"Metal, dielectric & copper construction"
Parameter,Specification,Application notes
Metal base material,"Aluminum (1060 / 5052 / 6061), Copper, Iron / stainless",
Structure,"Single-layer (1L), double-sided, multilayer metal-core, COB, copper-base sinkpad",
Thermal conductivity (dielectric),1.0 / 2.0 / 3.0 W/m·K standard · up to ~7 W/m·K advanced,
Dielectric thickness,75 / 100 / 125 µm,
Dielectric breakdown voltage,≥ 3 kV (typical),"Material/test-condition dependent; define duration, electrodes and leakage/trip limits."
Metal base thickness,0.5 – 3.0 mm (typ. 1.0 / 1.5 / 2.0 mm),
Copper weight (finished),1 oz – 10 oz (35 – 350 µm),
Board thickness,0.5 – 3.2 mm,
Earlier general construction range,1–4 layers; 0.5–4.6 mm finished thickness; 0.5–4 oz copper,Legacy construction range; select the actual material and route. Not interchangeable with the base-specific limits above.
Conditions,"Thermal conductivity refers to the dielectric, not the metal base or the assembled product. Choose the actual material grade and dielectric thickness together."

"Routing, holes & board dimensions"
Parameter,Specification,Application notes
Min. line width / space,0.15 mm / 0.15 mm (0.10 mm advanced),
Min. mechanical hole,0.5 mm (0.30 mm advanced),"Confirm drilling vs finished diameter, hole depth and material."
Max. board size,up to ~600 × 1200 mm (LED light bars),
Outline method,"Routing, V-groove, punch, beveling",
Outline tolerance,±0.10 – 0.15 mm,
Metal-base treatment,"Anodizing, countersink, counterbore, bending",
Conditions,The general process window and the earlier copper-dependent values describe different constructions. Review the selected copper thickness before applying the finest line/space.

Copper-dependent geometry — earlier fabrication reference
Copper,Minimum line / space,Condition
0.5 oz,4 / 4 mil (0.1016 / 0.1016 mm),Construction-specific review
1 oz,5 / 5 mil (0.127 / 0.127 mm),Construction-specific review
2 oz,5 / 7 mil (0.127 / 0.1778 mm),Construction-specific review
3 oz,7 / 8 mil (0.1778 / 0.2032 mm),Construction-specific review
4 oz,10 / 10 mil (0.254 / 0.254 mm),Construction-specific review
Conditions,"These earlier copper-specific values are retained for engineering comparison. They do not override the selected dielectric, base or fabrication route."

"Solder mask, legend & finish"
Parameter,Specification
Solder-mask colour,"White (high-reflectivity for LED), Green, Black, Blue, others"
Silkscreen colour,"Black, White, others"
Surface finish,"OSP, HASL / Lead-free HASL, ENIG, Immersion Silver / Tin, Electrolytic Gold, Gold fingers"
Conditions,Select the finish for assembly and storage needs. White mask reflectivity and thickness require a specified material and acceptance method.

"Thermal, insulation & reliability"
Parameter,Specification,Application notes
Thermal conductivity (dielectric),"1.0 – 3.0 W/m·K standard, up to ~7 W/m·K",
Thermal resistance,Low — set by dielectric type & thickness,
Dielectric breakdown,≥ 3 kV (Hi-pot tested),"Material/test-condition dependent; define duration, electrodes and leakage/trip limits."
Peel strength,≥ 1.4 N/mm,"Confirm laminate, copper, conditioning and test method."
Thermal shock,Solder float 288 ℃ / 10 sec,"Confirm specimen, conditioning, cycles and acceptance method; not an operating-temperature rating."
Flammability,94V-0 material / construction option,For the selected recognized material/construction; request the applicable UL file and thickness range.
Operating temperature,−40 ℃ to +140 ℃ (material dependent),Select the actual laminate and component system; material-dependent range.
Conditions,"Breakdown test voltage is not a working-voltage rating. Material conductivity, thermal resistance and operating temperature require grade-specific data and test conditions."