³Ô¹Ïtv,Rigid-Flex PCB Manufacturing Capabilities,2026.09.17-capabilities-r3
Scope,Process references; confirm the combined construction and acceptance plan.
Page,/rigid-flex-pcb-capability/

Region construction & materials
Parameter,Specification,Application notes
Rigid-flex total layers,2–32 layers,
Flexible layers (within),1–12 layers,
Rigid base material,FR-4 (High-Tg 150 / 170 available),
Flex base material,"Polyimide (PI / Kapton), PET, PEN",
Coverlay,Polyimide coverlay on flex areas,
Stiffeners,"FR4, aluminum, polyimide, stainless steel",
Finished thickness (rigid-flex),0.06–4.0 mm; define rigid and free-flex regions separately,
Copper weight,Flex 1/3 oz – 2 oz · rigid heavy copper to 12 oz,
Flex-section min trace / space,0.5 oz: 4/4 mil · 1 oz: 5/5 mil · 2 oz: 5/7 mil,
Through-hole aspect ratio,Up to 10:1 reference,"Apply to the through-hole depth/diameter definition, not a laser microvia."
Blind-via aspect ratio,Up to 0.75:1 reference,"Confirm dielectric depth, opening definition and the selected manufacturing process."
Conditions,"Flexible copper is part of the total layer count, not an addition to it. Flex copper limits apply only to the flexible region; high copper weights belong to rigid-region review."

Rigid-region conductors & holes
Parameter,Mass production,Prototype / extended review,Application notes
Min. inner-layer clearance,3 mil,3 mil,
Min. line width,3 mil (0.0762 mm),3 mil (0.0762 mm),
Min. line space,3 mil (0.0762 mm),3 mil (0.0762 mm),
Min. hole size,0.1 mm,0.1 mm,0.1 mm drill/process entry; earlier finished-hole reference is 0.152 mm. They are not equivalent dimensions.
Min. plated hole copper,25 µm,25 µm,Plated-through-hole reference; specify average/local minimum and acceptance class.
Min. blind / buried via,0.1 mm,0.1 mm (1–18 layers),"Define layer span, depth and opening diameter; confirm the complete via map."
PTH dia. tolerance,±0.076 mm (≈±3 mil),±0.076 mm (≈±3 mil),
NPTH dia. tolerance,±0.05 mm (≈±2 mil),±0.05 mm (≈±2 mil),
Hole position deviation,±0.05 mm (≈±2 mil),±0.05 mm (≈±2 mil),
Conditions,The 3 mil conductor values below refer to rigid regions. Use the copper-dependent flex values in the construction table for flexible tails. Confirm finished-hole diameter separately from drilling.

"Rigid-region copper, mask & marking"
Parameter,Mass production,Prototype / extended review,Application notes
Heavy copper (rigid),4 oz (nominal ≈140 µm),up to 12 oz,Review copper with line/space and construction; do not combine independent minima.
Min. solder-mask bridge,0.1 mm (≈4 mil),0.1 mm (≈4 mil),
Solder-mask colour,"Green, Black, Blue, White, Yellow, Red","Green, Black, Blue, White, Yellow, Red",
Silkscreen colour,"White, Yellow, Red, Black","White, Yellow, Red, Black",
Peelable mask,"Top, bottom, double-sided","Top, bottom, double-sided",
Conditions,"A 12 oz rigid-region option does not qualify a 12 oz flexible tail. Review copper balance, transition geometry and lamination for the complete board."

Profile & mechanical processing
Parameter,Mass production,Prototype / extended review
Outline method,"Routing, V-groove, beveling, punch","Routing, V-groove, beveling, punch"
Outline tolerance,±0.15 mm (≈±6 mil),±0.15 mm (≈±6 mil)
Conditions,"Specify each rigid outline, flex outline and transition boundary. V-scoring is a rigid-area option and must not cut a flexible interconnect."

Electrical & reliability requirements
Parameter,Mass production,Prototype / extended review,Application notes
Controlled impedance,±10%,±7%,"Agree signal/reference layers, geometry, coupon and test method."
Insulation resistance,1 × 10¹² Ω (normal),1 × 10¹² Ω (normal),"Confirm temperature, humidity, conditioning and test voltage."
Through-hole resistance,Per approved continuity test plan,Per approved continuity test plan,Continuity threshold and unit must be specified in the electrical-test plan.
Thermal shock,3 × 10 sec @ 288 ℃,3 × 10 sec @ 288 ℃,"Confirm specimen, conditioning, cycles and acceptance method; not an operating-temperature rating."
Warp & twist,≤ 0.7%,≤ 0.7%,Define the panel/board condition and measurement method.
Electric strength,> 1.3 kV/mm,> 1.4 kV/mm,Material test reference; confirm test method and dielectric construction.
Peel strength,1.4 N/mm,1.4 N/mm,"Confirm laminate, copper, conditioning and test method."
Solder-mask hardness reference,> 6H,> 6H,Reference >6H; specify the hardness test method. Do not interpret this as an abrasion-life rating.
Flammability,94V-0 material / construction option,94V-0 material / construction option,For the selected recognized material/construction; request the applicable UL file and thickness range.
Test voltage,50–330 V,50–330 V,Electrical-test setting; not rated operating voltage.
Conditions,"Impedance must be reviewed across transitions. Flatness, thermal stress and peel criteria require defined specimens and conditions; they do not replace bend-life qualification."