³Ô¹Ïtv,Rigid PCB Manufacturing Capabilities,2026.09.17-capabilities-r3
Scope,Process references; confirm the combined construction and acceptance plan.
Page,/rigid-pcb-capacity/

Layers & board dimensions
Parameter,Mass production,Prototype / extended review,Application notes
Layer count,1–24 layers,1–78 layers,
Max. panel size,600 × 770 mm (23.62″ × 30.31″),600 × 770 mm & 500 × 1200 mm (19.69″ × 47.24″),"Review finished-board array, process borders and usable panel area."
Max. board thickness,8.5 mm,8.5 mm,
Min. board thickness,2L: 0.3 mm · 4L: 0.4 mm · 6L: 0.8 mm,2L: 0.1 mm · 4L: 0.3 mm · 6L: 0.6 mm,
Conditions,Prototype limits are a separate process window. The 8.5 mm maximum thickness and the smallest hole are not a supported combined specification.

Conductor width & spacing
Parameter,Mass production,Prototype / extended review
Min. inner-layer clearance,3 mil,3 mil
Min. line width,3 mil (0.0762 mm),3 mil (0.0762 mm)
Min. line space,3 mil (0.0762 mm),3 mil (0.0762 mm)
Conditions,"Conductor limits depend on copper weight, layer and local pattern density. Quote the tightest geometry on each layer."

"Drilling, vias & hole plating"
Parameter,Mass production,Prototype / extended review,Application notes
Min. hole size,0.1 mm,0.1 mm,"Confirm drilling vs finished diameter, hole depth and material."
Min. plated hole copper,25 µm,25 µm,Plated-through-hole reference; specify average/local minimum and acceptance class.
Min. blind / buried via,0.1 mm,0.1 mm (1–18 layers),"Define layer span, depth and opening diameter; confirm the complete via map."
PTH dia. tolerance,±0.076 mm (≈±3 mil),±0.076 mm (≈±3 mil),
NPTH dia. tolerance,±0.05 mm (≈±2 mil),±0.05 mm (≈±2 mil),
Hole position deviation,±0.05 mm (≈±2 mil),±0.05 mm (≈±2 mil),
Conditions,"Define whether a diameter refers to a drill tool, finished plated hole or laser opening. The 0.1 mm entry needs a hole-specific process review."

"Copper, solder mask & marking"
Parameter,Mass production,Prototype / extended review,Application notes
Heavy copper,4 oz (nominal ≈140 µm),up to 12 oz,Review copper with line/space and construction; do not combine independent minima.
Min. solder-mask bridge,0.1 mm (≈4 mil),0.1 mm (≈4 mil),
Solder-mask colour,"Green, Black, Blue, White, Yellow, Red","Green, Black, Blue, White, Yellow, Red",
Silkscreen colour,"White, Yellow, Red, Black","White, Yellow, Red, Black",
Peelable mask,"Top, bottom, double-sided","Top, bottom, double-sided",
Conditions,Heavy copper requires wider line and space. Solder-mask bridge capability also depends on colour and pad geometry.

Profile & mechanical processing
Parameter,Mass production,Prototype / extended review
Outline method,"Routing, V-groove, beveling, punch","Routing, V-groove, beveling, punch"
Outline tolerance,±0.15 mm (≈±6 mil),±0.15 mm (≈±6 mil)
Conditions,"Dimension the finished profile and any bevel, score depth or edge plating on the fabrication drawing."

Electrical & reliability requirements
Parameter,Mass production,Prototype / extended review,Application notes
Controlled impedance,±10%,±7%,"Agree signal/reference layers, geometry, coupon and test method."
Insulation resistance,1 × 10¹² Ω (normal),1 × 10¹² Ω (normal),"Confirm temperature, humidity, conditioning and test voltage."
Through-hole resistance,Per approved continuity test plan,Per approved continuity test plan,Continuity threshold and unit must be specified in the electrical-test plan.
Thermal shock,3 × 10 sec @ 288 ℃,3 × 10 sec @ 288 ℃,"Confirm specimen, conditioning, cycles and acceptance method; not an operating-temperature rating."
Warp & twist,≤ 0.7%,≤ 0.7%,Define the panel/board condition and measurement method.
Electric strength,> 1.3 kV/mm,> 1.4 kV/mm,Material test reference; confirm test method and dielectric construction.
Peel strength,1.4 N/mm,1.4 N/mm,"Confirm laminate, copper, conditioning and test method."
Solder-mask hardness reference,> 6H,> 6H,Reference >6H; specify the hardness test method. Do not interpret this as an abrasion-life rating.
Flammability,94V-0 material / construction option,94V-0 material / construction option,For the selected recognized material/construction; request the applicable UL file and thickness range.
Test voltage,50–330 V,50–330 V,Electrical-test setting; not rated operating voltage.
Conditions,"Electrical and reliability values require an agreed method, specimen and acceptance plan. Test voltage is not a continuous operating-voltage rating."