Key Features:

• Exceptional Heat Dissipation: Aluminum core provides 5-8x better thermal conductivity than standard FR4 substrates
• Reliable Electrical Isolation: High-performance dielectric layer ensures safe electrical separation between circuits and aluminum base
• Enhanced Component Lifespan: Effective heat removal reduces thermal stress on LEDs, power transistors, and other heat-sensitive components
• Lightweight Design: Aluminum construction offers excellent strength-to-weight ratio compared to ceramic alternatives

Technical Specifications:

• Thermal conductivity: 1.0-3.0 W/mK (dielectric layer)
• Base material: High-purity aluminum alloy
• Dielectric breakdown voltage: >3000V
• Operating temperature range: -40簞C to +150簞C
• Available thicknesses: 0.8mm to 3.2mm

Applications:

• High-power LED lighting systems
• Automotive electronics and lighting
• Power converters and inverters
• RF and microwave amplifiers
• Solar panel junction boxes
• Industrial motor drives

Benefits: This substrate solution enables designers to achieve higher power densities while maintaining reliability. The aluminum core acts as both a heat spreader and mechanical support, eliminating the need for additional heat sinks in many applications. Compatible with standard PCB manufacturing processes, it offers a cost-effective thermal management solution for demanding electronic systems.

Ideal for applications requiring efficient heat dissipation, electrical isolation, and mechanical durability in a single substrate solution.

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