Our ceramic printed circuit boards deliver unmatched performance in demanding high-temperature applications where traditional FR-4 substrates fail. Built with advanced ceramic materials including aluminum oxide (����₂O₃) and aluminum nitride (AlN), these PCBs maintain structural integrity and electrical performance at temperatures exceeding 300°C.

Key Features

Superior Thermal Management

• Exceptional thermal conductivity (up to 260 W/mK with AlN substrates)
• Efficient heat dissipation prevents component degradation
• Minimal thermal expansion matching semiconductor die characteristics

High Temperature Stability

• Operating temperature range: -55°C to +850°C
• Zero performance degradation at extreme temperatures
• Maintains dimensional stability under thermal cycling

Electrical Excellence

• Low dielectric loss for high-frequency applications
• Excellent electrical insulation properties
• Stable impedance characteristics across temperature ranges
• Superior signal integrity in RF/microwave applications

Mechanical Durability

• High flexural strength and fracture toughness
• Resistance to thermal shock and mechanical stress
• Hermetic sealing capabilities for harsh environments

Applications

Automotive Electronics Engine control units, exhaust sensors, and under-hood applications requiring operation at 150-200°C

Aerospace & Defense Satellite electronics, jet engine monitoring systems, and military radar applications

Industrial Processing High-temperature sensors, furnace controls, and process monitoring equipment

Power Electronics LED drivers, power modules, and high-power RF amplifiers requiring excellent heat dissipation

Oil & Gas Downhole electronics, wellhead monitoring systems, and high-temperature logging tools

Manufacturing Capabilities

We offer comprehensive ceramic PCB solutions including single and multi-layer configurations, thick and thin film metallization, and precision via drilling. Our advanced manufacturing processes ensure consistent quality and reliability for mission-critical applications where failure is not an option.

Contact our engineering team to discuss your specific high-temperature PCB requirements and explore how our ceramic solutions can enhance your product’s performance and reliability.

The post RAYMING Ceramic PCB Manufacturing – High Temperature Applications appeared first on �Թ�tv.

1. Composition: Thin film ceramic PCBs are made by depositing very thin layers of conductive materials (usually metals like copper, gold, or silver) onto a ceramic substrate. The ceramic base is typically made of materials like alumina (Al2O3) or aluminum nitride (AlN).

2. Manufacturing process: The thin film is created through processes such as sputtering, evaporation, or chemical vapor deposition. These methods allow for extremely precise and thin layers of conductive material to be applied to the ceramic substrate.

3. Key advantages:

• High thermal conductivity: Ceramic substrates can dissipate heat more efficiently than traditional FR-4 boards.
• Excellent electrical properties: Low dielectric constant and loss tangent, which is beneficial for high-frequency applications.
• Dimensional stability: Ceramic materials maintain their shape and size under varying temperatures.
• Fine line resolution: Allows for very small feature sizes and high-density circuits.
• Chemical resistance: Ceramic substrates are inert to many chemicals.

4. Applications: Thin film ceramic PCBs are often used in:

• High-frequency and microwave circuits
• Aerospace and military equipment
• High-power LED modules
• Sensors and MEMS devices
• High-temperature applications

5. Limitations:

• Higher cost compared to traditional PCB materials
• More complex manufacturing process
• Can be more brittle than other PCB types

6. Comparison to thick film technology: While both use ceramic substrates, thin film technology allows for finer lines and spaces, and generally offers better performance at high frequencies.

The post RayMing Thin film ceramic PCB appeared first on �Թ�tv.

1. Composition:

• Substrate: Made of ceramic materials, typically alumina (Al2O3) or aluminum nitride (AlN)
• Conductive layers: Thick film pastes containing metal particles (e.g., silver, gold, platinum)
• Resistive layers: Special pastes for creating resistors directly on the board

1. Manufacturing process:

• Screen printing: Conductive and resistive pastes are applied to the ceramic substrate through a fine mesh screen
• Firing: The board is fired at high temperatures (usually around 850°C) to sinter the metal particles and bond them to the ceramic

1. Key features:

• Excellent thermal conductivity
• High temperature resistance (can operate at temperatures up to 350°C)
• Good electrical insulation properties
• Mechanically robust and resistant to harsh environments
• Ability to integrate passive components (resistors, capacitors) directly on the board

1. Applications:

• High-power electronics
• Automotive and aerospace industries
• LED lighting modules
• RF and microwave circuits
• Sensors and transducers in harsh environments

1. Advantages:

• Superior heat dissipation compared to traditional FR-4 PCBs
• High reliability in extreme conditions
• Compact design due to integrated passive components
• Excellent dimensional stability

1. Limitations:

Thick Film Ceramic PCBs are particularly useful in applications where high temperature resistance, thermal management, and reliability in harsh environments are crucial. They offer a robust solution for specialized electronic systems that need to operate under extreme conditions.

The post RayMing Thick Film Ceramic PCB appeared first on �Թ�tv.

Layer: 4 Layer PCB

Dielectric Constant:10.2

Board thickness: 1.2mm

Surface finsihed: ENEPIG

Solder Mask：none
Silkscreen: None.

Understanding the PCB Structure

Rogers 3010 Material

Rogers 3010 is a high-performance ceramic-filled PTFE composite material known for its excellent electrical properties, particularly at high frequencies. Some key characteristics include:

FR4 Material

FR4 is a glass-reinforced epoxy laminate material widely used in PCB manufacturing. It offers a good balance between cost and performance for many applications. Key properties include:

Hybrid Stack-up

The hybrid stack-up combines the benefits of both Rogers 3010 and FR4 materials. A typical configuration might look like this:

1. Top Layer: Rogers 3010
2. Inner Layer 1: FR4
3. Inner Layer 2: FR4
4. Bottom Layer: Rogers 3010

This arrangement allows for high-frequency signal routing on the outer layers while maintaining cost-effectiveness with FR4 inner layers.

ENEPIG Surface Finish

What is ENEPIG?

ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold. It’s a high-performance surface finish that offers several advantages:

1. Excellent solderability
2. Long shelf life
3. Flat surface for fine-pitch components
4. Compatibility with both tin-lead and lead-free solders

ENEPIG Layer Structure

The ENEPIG finish consists of multiple layers:

Benefits of 4 Layer 1.2mm Rogers 3010 + FR4 Hybrid ENEPIG PCB

1. Improved Signal Integrity: The low-loss Rogers 3010 material on outer layers enhances signal integrity for high-frequency applications.
2. Cost-Effectiveness: The use of FR4 for inner layers helps reduce overall material costs compared to all-Rogers designs.
3. Enhanced Thermal Management: The hybrid stack-up offers better thermal performance than pure FR4 boards.
4. Excellent Surface Finish: ENEPIG provides superior solderability and pad flatness for fine-pitch components.
5. Balanced Performance: Combines the strengths of high-frequency materials with standard FR4 capabilities.

Applications

This specialized PCB configuration finds use in various high-frequency and high-speed applications, including:

• 5G and wireless communication equipment
• Radar systems
• Satellite communication devices
• High-speed digital systems
• Test and measurement equipment
• Aerospace and defense electronics

Manufacturing Process

Step 1: Material Preparation

The process begins with the preparation of Rogers 3010 and FR4 materials, cutting them to the required size and cleaning them thoroughly.

Step 2: Inner Layer Processing

The FR4 inner layers are processed first, including:

• Copper patterning
• Oxide treatment
• Optical inspection

Step 3: Layer Stack-up and Lamination

The layers are stacked in the following order:

1. Rogers 3010 (top)
2. FR4 (inner layer 1)
3. FR4 (inner layer 2)
4. Rogers 3010 (bottom)

The stack is then laminated under high pressure and temperature.

Step 4: Drilling and Plating

• Holes are drilled according to the design specifications.
• The board undergoes desmear and electroless copper plating.

Step 5: Outer Layer Processing

The Rogers 3010 outer layers are processed, including:

• Copper patterning
• Soldermask application
• Silkscreen printing

Step 6: ENEPIG Plating

The ENEPIG surface finish is applied in the following sequence:

1. Electroless nickel plating
2. Electroless palladium plating
3. Immersion gold plating

Step 7: Final Inspection and Testing

The completed PCBs undergo rigorous inspection and testing, including:

• Automated optical inspection (AOI)
• Electrical testing
• Impedance testing
• X-ray inspection for internal layers

Frequently Asked Questions (FAQ)

Q1: Why use a hybrid PCB with Rogers 3010 and FR4?

A1: The hybrid design combines the excellent high-frequency performance of Rogers 3010 on the outer layers with the cost-effectiveness of FR4 on the inner layers. This approach optimizes both performance and cost for applications requiring high-frequency capabilities.

Q2: What are the advantages of ENEPIG finish over other surface finishes?

A2: ENEPIG offers excellent solderability, long shelf life, compatibility with various soldering processes, and a flat surface ideal for fine-pitch components. It also provides better corrosion resistance compared to some other finishes.

Q3: Is this PCB suitable for all high-frequency applications?

A3: While this PCB configuration is excellent for many high-frequency applications, the suitability depends on specific requirements such as operating frequency, power levels, and environmental conditions. It’s best to consult with a PCB design expert for your particular application.

Q4: How does the 1.2mm thickness affect the PCB performance?

A4: The 1.2mm thickness is a balance between mechanical stability and electrical performance. It allows for good signal integrity while maintaining sufficient rigidity. However, the optimal thickness depends on the specific application and design constraints.

Q5: Can this PCB be modified for different layer counts or thicknesses?

A5: Yes, the basic concept of a Rogers 3010 + FR4 hybrid with ENEPIG finish can be adapted to different layer counts and thicknesses. However, any changes should be carefully considered in terms of electrical performance, mechanical properties, and manufacturing feasibility.

The post RAYMING 4 Layer 1.2mm Rogers 3010 + FR4 Hybrid ENEPIG PCB appeared first on �Թ�tv.

Rogers · Product specification

6-Layer RO3006 PTFE PCB

Define a six-layer RO3006 build without confusing process Dk with design Dk.

RO3006 is a ceramic-filled PTFE laminate. The 6.15 value in the historical product name is process Dk; Rogers lists a different design Dk. A six-layer board also needs an explicitly identified bonding system.

Discuss this constructionOpen the engineering tool

Send preliminary files or a released drawing. Identify the material, quantity and open decisions.

03 / Engineering calculations

RF design workbench: width, phase and loss

Work with 6-Layer RO3006 PTFE PCB using the exact construction data. Select a line model or a planar passive calculation. Results explain the assumptions and can be downloaded with the entered values.

�Թ�tv ENGINEERING

PTFE RF Design Workbench

PTFE Engineering

Loading PTFE RF Design Workbench…

Read dielectric data in the right context

A material data table and a circuit simulation answer different questions. Process Dk is used in a defined material measurement. Design Dk is a supplier modeling reference. Effective permittivity belongs to the transmission-line geometry and includes how its fields occupy the surrounding media. Keep those labels attached when copying values into a drawing, a calculator or an RF model. An unlabeled number is difficult to audit later.

For a microstrip, identify the distance between the trace and its continuous reference plane. Do not enter total board thickness unless that dimension really is the dielectric height. For centered stripline, this workbench asks for total ground-plane spacing. An asymmetric stripline, a coplanar line with backside ground, solder mask over the trace or a mixed-dielectric stack requires a model that actually represents those features.

Use the calculation to establish scale and sensitivity. The workbench uses a zero-thickness, quasi-static line model, so it does not compensate for finished copper, etch shape, roughness, dispersion or transitions. A narrower nominal trace is not automatically a better layout. Check routability and tolerances, then correlate the chosen geometry with a field solver and an agreed fabrication coupon.

05 / Review the construction

Design-to-build review for 6-Layer RO3006 PTFE PCB

What to send for an engineering quotation

Send the circuit artwork in the agreed fabrication format, drill data, board outline, mechanical notes, quantity and revision. Add a stackup that names every core and bonding layer, dielectric thickness, copper requirement and surface finish. Identify open decisions clearly; a preliminary drawing can start a discussion, but it should not be mistaken for an approved production release.

For controlled impedance, list each target, tolerance, signal layer and reference layer. State whether the requirement is single-ended or differential and provide any intended coupon or test method. For a material-controlled build, include the exact manufacturer designation and the document revision used in design. Describe approved substitutions explicitly, or say that changes require written engineering approval.

If the order includes assembly, supply the BOM with manufacturer part numbers, placement data, assembly drawing and test expectations. Discuss connector attachment, thermal exposure and any fragile or thin RF regions before fabrication. The board material, bonding film and subsequent assembly profile must be reviewed as a system. Sending these details early makes quotations easier to compare and reduces ambiguous assumptions.

The post 6-Layer RO3006 PTFE PCB appeared first on �Թ�tv.

Board Material: Alumina

Board thickness: 1.6mm

Layer: 2 layers PCB

The post RAYMING 2 Layer Aluminum Oxide HTCC Ceramic Circuit Boards appeared first on �Թ�tv.

Board Thickness: 1.2mm

PCB size: 65x65mm

Ceramic PCB line spacing: 40mil/40mil

Minimum hole size: 1.5mm

Surface Finished: chemical gold immersion

Thickness of gold immersion:2u” PCB board material: ceramic

PCB copper thickness: 1/1oz Ceramic thermal conductivity: 20W/M

Processing Difficulty:Fragile Ceramic Board

Technical Characteristics:High thermal conductivity, high insulation, low loss

The post RayMing 2 Layer Ceramic Immersion PCB Circuit Board appeared first on �Թ�tv.

Material: Aluminum Nitride

Surface finished: ENEPIG ( nickel palladium gold)

Layer: Double sided pcb

Thickness of finished product: 0.54mm (tolerance ±0.15mm)

Characteristics: strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding force, anti-corrosion; excellent thermal cycling performance.

Application field introduction:

1, high-power power semiconductor modules; semiconductor cooler, electronic heater; power control circuits, power hybrid circuits.

2、Intelligent power components; high-frequency switching power supply, solid state relays.

3, Automotive electronics, aerospace and military electronic components.

4, solar panel components; telecommunications special switch, receiving system; laser and other industrial electronics.

The post RayMing Aluminum Nitride Ceramic Planar Substrates PCB appeared first on �Թ�tv.

Material: Aluminum Oxide Ceramic

Plate thickness: 1.0+/-0.05mm

Plate used: 96% aluminum oxide

Surface treatment: immersion gold

Thermal conductivity of insulation layer: 30W

Outer copper thickness: 35um

Gold thickness: >=2′

Process characteristics: dpc process

is a precision ceramic material with the following advantages:

High heat resistance and thermal conductivity: alumina ceramic substrate has excellent heat resistance and thermal conductivity, can withstand high temperature environment and conduct heat effectively.

High mechanical strength: alumina ceramic substrate has high strength and hardness, able to withstand mechanical stress.

Good electrical insulation properties: alumina ceramic substrate has good electrical insulation properties, can be used in the manufacture of electronic components that require high insulation properties.

Good chemical stability: alumina ceramic substrate has excellent chemical stability, can resist the erosion of various chemical substances, to maintain its stable performance.

Alumina ceramic substrates also have the advantages of high biocompatibility and low coefficient of thermal expansion. In terms of application, alumina ceramic substrates are widely used in LED power lighting, high-power power semiconductor modules, power control circuits, intelligent power components, automotive electronics, aerospace and military electronic components and other fields.

The post RayMing Aluminum Oxide Ceramic PCB Circuit Boards appeared first on �Թ�tv.