吃瓜tv 路 Material selection & fabrication
High Tg PCB Materials & Manufacturing
Choose a laminate around the thermal exposure, multilayer construction and acceptance requirements of your board. Compare named grades, understand the temperature tests and prepare a fabrication enquiry with the details that affect reliability and cost.
Send files for a material & fabrication quotePreliminary files welcome. Identify the grade, test method and unresolved requirements.
What is a high Tg PCB?
A high Tg PCB uses a laminate whose resin has an elevated glass transition temperature. In rigid epoxy FR-4 purchasing, 鈥渉igh Tg鈥� commonly describes grades around 170掳C and above, but the material identity and test method must be stated. Tg is not melting temperature, maximum continuous operating temperature or proof of high-frequency performance.
Start by naming the concern: repeated soldering, plated-hole reliability, a sustained hot spot, electrical loss, tracking resistance or a demanding environment. Each concern requires different evidence; a larger Tg number does not resolve all of them.
| Grade page | Primary question | Useful starting point |
|---|---|---|
| Tg135 PCB | Can a standard FR-4 grade meet the actual requirement? | Compare process exposure and electrical needs before paying for a different material. |
| Tg150 PCB | What does a mid-Tg requirement buy? | Distinguish an exact 150掳C DSC grade from a 155掳C supplier product. |
| Tg170 PCB | Which actual grade and soldering data are required? | A 170掳C label alone does not approve a 175掳C or 180掳C substitute. |
| Tg180 PCB | How does the laminate support a multilayer build? | Review Z expansion, holes, copper balance and assembly cycles. |
| Tg200 PCB | Is 200掳C measured by DSC, DMA or TMA? | Separate method differences from operating-temperature requirements. |
| Tg260 PCB | Does the design need a rigid polyimide system? | Review core/prepreg, moisture handling, processing and flammability. |
| Tg300 PCB | Does 300 mean Tg, a T300 test or service exposure? | Clarify the specification before claiming a qualified material. |
Move from a material question to a quotable build
For an early enquiry, send the current stackup and explain the intended operating and assembly exposure. Use this optional planner to organize the specification and, if available, your own cost allowances. You can contact us without completing the tool.
HIGH-TG Quotation Planner
Six properties that should not be confused
| Property | What it describes | What it does not establish |
|---|---|---|
| Tg, with test method | A transition identified from a thermal or mechanical measurement. | A universal maximum board operating temperature. |
| Td, with mass-loss criterion | Decomposition under a defined thermogravimetric test. | A permissible service temperature or soldering profile. |
| T260 / T288 / T300 | Time to delamination under a specified temperature/test condition. | A glass transition temperature of 260, 288 or 300掳颁. |
| Z expansion / Z-axis CTE | Thickness-direction response over a stated temperature interval. | Via fatigue life, stress or finished-board warpage on its own. |
| RTI / applicable recognition | Long-term thermal information within a defined material/recognition scope. | A blanket rating for every PCB stackup, component or assembled product. |
| CTI and Dk / Df | Tracking resistance and electrical properties measured under stated conditions. | Properties that can be inferred from Tg alone. |
Glass Transition Explanation
Compare actual laminate systems
| Candidate / 吃瓜tv guide | Tg and method | Td, 5% mass loss | Z expansion, 50鈥�260掳C | Evidence |
|---|---|---|---|---|
| Shengyi S1600 | 135掳C 路 DSC | 310掳颁 | 4.5% | |
| Isola IS400 | 150掳C 路 DSC | 330掳颁 | 3.3% | |
| Shengyi S1000H | 155掳C 路 DSC (160掳C DMA) | 348掳颁 | 2.8% | |
| Isola FR406 | 170掳C 路 DSC | 300掳颁 | 3.5% | |
| ITEQ IT-180A | 175掳C 路 DSC | See current source | Not transcribed | |
| Isola 370HR | 180掳C 路 DSC | 340掳颁 | 2.8% | |
| Shengyi S1000-2M | 180掳C 路 DSC (185掳C DMA) | 355掳颁 | 2.4% | |
| Shengyi S1190 | 200掳C 路 DMA (170掳C TMA) | 350掳颁 | 2.3% | |
| Isola IS415 | 200掳C 路 DSC | 370掳颁 | 2.8% | |
| Isola P95 / P25 | 260掳C 路 DSC | 416掳颁 | 1.5% | |
| Shengyi SH260 | >250掳C 路 TMA; >250掳C | 429掳颁 | 1.2% |
Typical published data, not purchase minima or a stock list. Methods, specimen construction and conditioning may differ. Confirm the supplier revision and the exact supplied construction. A missing entry is not zero.
Example: S1190 is listed at 170掳C by TMA and 200掳C by DMA. These are two measurements for one material, not a conversion formula. Compare like methods and a current supplier datasheet before accepting an alternative.
For supplier families, see Isola PCB materials and Shengyi PCB materials. The linked 吃瓜tv model pages provide further context; the manufacturer references above are the basis for the values in this table.
Understand the scale of Z expansion
HIGH-TG Engineering Workbench
A 1.6 mm laminate with 2.8% total expansion corresponds to 44.8 碌m of gross thickness change over 50鈥�260掳C. That simple dimensional result does not calculate the strain in a plated hole. Glass reinforcement, resin, copper, hole geometry and processing constrain the actual structure.
Choose around the failure mechanism
| Design concern | Review together | Continue to |
|---|---|---|
| Repeated reflow or rework | Measured board profile, number of cycles, moisture history, Td and delamination test conditions. | Tg180 multilayer planning |
| Thick boards and plated holes | Total Z expansion, hole diameter, plating, laminate construction and validation coupons. | Multilayer stackup design |
| Sustained heat or high power | Real board hot spots, heat path, component limits, environment and lifetime test plan. | Metal-core heat paths / ceramic substrates |
| RF or high-speed signals | Design Dk, Df at frequency, foil roughness, stackup and interconnect geometry. | High-frequency PCB design |
| High voltage or humidity | CTI, clearances/creepage, insulation system, cleanliness and CAF requirements. | Specify the relevant product requirements rather than selecting by Tg. |
What to agree before manufacturing
- Material manufacturer, complete grade/suffix, core and prepreg system, required Tg method and permitted substitutions.
- Layer order, finished thickness, copper weights, hole structure, impedance targets and copper balance.
- Assembly exposure: process peak, time, number of passes, expected rework and moisture handling.
- Bare-board standard/class/revision, agreed electrical and construction checks, thermal test coupons and records where required.
- Quantity, destination, required date and the division between fabrication, assembly and product validation.
Review the rigid PCB capability table, manufacturing equipment and quality requirements in the context of your build. For functional samples, coordinate prototype PCB assembly with the approved material and thermal profile.
A first-build cross section or a thermal-cycling report is useful evidence only when its specimen, conditions, acceptance criteria and relationship to your construction are clear. These records should be agreed during quotation; this page does not claim a test has already been performed for your project.
What changes high Tg PCB cost?
There is no defensible universal 鈥淭g premium.鈥� The chosen laminate system, available thicknesses, copper, panel utilization, drilling/desmear, lamination sequence and required inspection all affect the quotation. A readily available high-Tg epoxy may be a simpler procurement choice than an unusual exact-grade requirement; confirm availability instead of assuming a fixed percentage.
Compare quotations with the same approved construction. Separate material/setup, bare-board fabrication, optional tests, assembly, expediting and freight. A rigid polyimide build needs its own process quote. The planner鈥檚 optional sensitivity range uses your allowances and is not a 吃瓜tv price list.
High Tg PCB questions
Is high Tg FR-4 the same as high-temperature PCB?
High Tg FR-4 describes a resin transition property. A high-temperature application also needs review of service duration, electrical load, material recognition, assembly and product qualification. Neither phrase alone is a complete specification.
Does Tg170 mean the board can run at 170掳C?
No. Tg is not a universal continuous operating limit. Use the actual board hot-spot temperature, duration, cycling and applicable material and product requirements.
Can lead-free soldering use a laminate below its peak temperature?
A short soldering exposure is different from continuous service. Compare the supplier鈥檚 thermal data and the actual assembly profile, moisture condition and number of cycles; Tg alone neither approves nor rejects the process.
Is Tg200 always better than Tg180?
No. The methods may differ, and expansion, Td, moisture behavior, electrical loss and processing matter separately. Use the exact grade and a consistent test basis.
Does high Tg mean low dielectric loss?
No. Compare Dk and Df at the relevant frequency and construction. High-Tg standard-loss epoxy and low-loss RF laminates serve different needs.
Can I replace the material with an equivalent Tg?
Only after an explicit review of the full requirements. A matching Tg value does not establish equivalent expansion, thermal endurance, flammability, CAF behavior, electrical properties or processing.
Are Tg260 and Tg300 ordinary FR-4 options?
Some Tg260 requirements lead to rigid polyimide systems. A Tg300 request needs a documented grade and method; a T300 delamination result is not a Tg300 rating. Confirm the complete material and manufacturing route.
What files should accompany an enquiry?
Send fabrication artwork and drills, outline, stackup, copper, finish, material or unresolved material requirement, quantity, exposure conditions and acceptance/test requirements. Include BOM and placement data if assembly is needed.
Manufacturer references
Values reviewed on 17 September 2026. Published typical values can change with revision and do not replace an agreed purchase specification.
Send the stackup and the thermal requirement
Name the material if it is fixed. Otherwise, describe the concern to solve and mark the grade for review. Agree the supplier data, fabrication route, inspection scope and schedule before the build is released.
Request a High Tg PCB review