³Ô¹Ïtv

Month: May 2021

What is Nan Ya PCB?

Introduction: NanYa PCB produces and sells printed circuit boards and embedded system substances. The firm is based in Taiwan. In Taiwan and mainland China, the organization produces the bulk of its sales by area. The company’s manufactured printed circuit boards are used in personal machines, notebooks, home appliances, tablets, gaming, and mobile devices motherboards. The firm […]

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What is the Difference Between SMD Soldering and DIP Soldering?

Introduction Soldering is a critical process used to attach electronic components to printed circuit boards (PCBs) and form reliable electrical and mechanical joints. The two most common soldering methods are reflow soldering surface-mount devices (SMDs) and wave soldering through-hole dual in-line package (DIP) components. This article examines the key differences between soldering SMD and DIP […]

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What’s the Difference between EMI EMS and EMC ?

³Ô¹Ïtv · ENGINEERING GUIDEEMI vs EMS vs EMC: Connect the Terms to the Engineering TaskEMI describes electromagnetic interference. In an EMC discussion, EMS commonly refers to electromagnetic susceptibility, while EMC describes compatibility in the intended electromagnetic environment. These terms help separate the disturbance source, the…

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What is Carbon Ink PCB ?

Carbon ink PCB (printed circuit board) is coated on the PCB substrate with carbon-based conductive ink (referred to as carbon ink), cured to form a PCB with a carbon film conductive pattern. Now the market’s requirements for PCB board production costs have dropped repeatedly, and it is a general trend to use carbon oil keys to […]

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What is PCB Edge Plating?

PCB Manufacturing / PCB Surface Finish³Ô¹Ïtv · Conductive boundary · process mapPCB edge plating: define the conductive boundaryPlan plated sidewalls, net connections, unplated regions and panel tabs. Turn an edge-plating request into an inspectable fabrication drawing.Review your plated-edge drawingOpen the worksheetPreliminary files and open process…

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What is Wire Bonding?

Wirebonding Temperature (oC) Pressure Wire Ultrasonic energy Thermocompression 300 – 500 High Au No Ultrasonic 25 Low Au, Al Yes Thermosonic 100 – 150 Low Au Yes Introduction Wire bonding is a method used to electrically and mechanically join conductive wires to semiconductor chips and substrates to make interconnections. It is a key process used […]

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