Quick Presets

Copper Layers

Prepreg Layers

Core Layers

Total Board Thickness
1.600mm
1600 ?m
vs 1.6mm
+0 ?m
Copper (8L)
280 ?m
Prepreg (4L)
598 ?m
Core (3L)
600 ?m

Stackup Visualization

L1 – Top SignalSIG 35?m
Prepreg 1 (PP1) 114?m
L2 – GND PlaneGND 35?m
Core 1 (FR-4) 200?m
L3 – Inner SignalSIG 35?m
Prepreg 2 (PP2) 185?m
L4 – PWR PlanePWR 35?m
Core 2 – Center (FR-4) 200?m
L5 – GND PlaneGND 35?m
Prepreg 3 (PP3) 185?m
L6 – Inner SignalSIG 35?m
Core 3 (FR-4) 200?m
L7 – PWR PlanePWR 35?m
Prepreg 4 (PP4) 114?m
L8 – Bottom SignalSIG 35?m
SOLDER MASK (BOTTOM)
Outer Signal
Inner Signal
GND Plane
PWR Plane
Prepreg
Core
? Common 8-Layer Targets
1.0mm: High-density mobile/wearable
1.6mm: Standard multilayer (most common)
2.0mm: Industrial, automotive
2.4mm: Power systems, thick copper
? 8-Layer Design Tips
Signal Integrity: L3 & L6 are shielded by adjacent planes – ideal for high-speed signals.
Power Distribution: L4 & L5 form a tightly-coupled power/ground pair – excellent for decoupling.
? Impedance Control
Outer layers (L1, L8): Microstrip impedance
Inner layers (L3, L6): Stripline impedance
Adjust PP thickness to tune impedance values.