Aluminum or copper base
Select the base with the heat-source footprint, cooling interface and mechanical envelope. A more conductive base does not remove the dielectric thermal resistance.
吃瓜tv / Manufacturing specifications
Metal-Core PCB Manufacturing Capabilities
Compare the metal base, insulating dielectric, circuit copper and machining options as a complete thermal and electrical construction.
- Metal-base options
- Al / Cu / Fe
- Standard dielectric options
- 1鈥�3 W/m路K
- Advanced dielectric 路 review
- Up to ~7 W/m路K
- Copper process envelope
- 1鈥�10 oz
Full process capability tables
Select the construction with the metal-core PCB materials and design guide. For base-specific decisions see aluminum PCB thermal planning, copper-base and DTP review or ferrous substrate specification. The fabrication process guide explains the inspection stages.
Use the matching construction and production window. Dimensions, copper and via limits must be reviewed together; an extended capability is confirmed against the released drawing.
Capability tables (CSV)Metal, dielectric & copper construction
| Parameter | Specification | Application notes |
|---|---|---|
| Metal base material | Aluminum (1060 / 5052 / 6061), Copper, Iron / stainless | |
| Structure | Single-layer (1L), double-sided, multilayer metal-core, COB, copper-base sinkpad | |
| Thermal conductivity (dielectric) | 1.0 / 2.0 / 3.0 W/m路K standard 路 up to ~7 W/m路K advanced | |
| Dielectric thickness | 75 / 100 / 125 碌m | |
| Dielectric breakdown voltage | 鈮� 3 kV (typical) | Material/test-condition dependent; define duration, electrodes and leakage/trip limits. |
| Metal base thickness | 0.5 鈥� 3.0 mm (typ. 1.0 / 1.5 / 2.0 mm) | |
| Copper weight (finished) | 1 oz 鈥� 10 oz (35 鈥� 350 碌m) | |
| Board thickness | 0.5 鈥� 3.2 mm | |
| Earlier general construction range | 1鈥�4 layers; 0.5鈥�4.6 mm finished thickness; 0.5鈥�4 oz copper | Legacy construction range; select the actual material and route. Not interchangeable with the base-specific limits above. |
Thermal conductivity refers to the dielectric, not the metal base or the assembled product. Choose the actual material grade and dielectric thickness together.
Routing, holes & board dimensions
| Parameter | Specification | Application notes |
|---|---|---|
| Min. line width / space | 0.15 mm / 0.15 mm (0.10 mm advanced) | |
| Min. mechanical hole | 0.5 mm (0.30 mm advanced) | Confirm drilling vs finished diameter, hole depth and material. |
| Max. board size | up to ~600 脳 1200 mm (LED light bars) | |
| Outline method | Routing, V-groove, punch, beveling | |
| Outline tolerance | 卤0.10 鈥� 0.15 mm | |
| Metal-base treatment | Anodizing, countersink, counterbore, bending |
The general process window and the earlier copper-dependent values describe different constructions. Review the selected copper thickness before applying the finest line/space.
Copper-dependent geometry 鈥� earlier fabrication reference
| Copper | Minimum line / space | Condition |
|---|---|---|
| 0.5 oz | 4 / 4 mil (0.1016 / 0.1016 mm) | Construction-specific review |
| 1 oz | 5 / 5 mil (0.127 / 0.127 mm) | Construction-specific review |
| 2 oz | 5 / 7 mil (0.127 / 0.1778 mm) | Construction-specific review |
| 3 oz | 7 / 8 mil (0.1778 / 0.2032 mm) | Construction-specific review |
| 4 oz | 10 / 10 mil (0.254 / 0.254 mm) | Construction-specific review |
These earlier copper-specific values are retained for engineering comparison. They do not override the selected dielectric, base or fabrication route.
Solder mask, legend & finish
| Parameter | Specification |
|---|---|
| Solder-mask colour | White (high-reflectivity for LED), Green, Black, Blue, others |
| Silkscreen colour | Black, White, others |
| Surface finish | OSP, HASL / Lead-free HASL, ENIG, Immersion Silver / Tin, Electrolytic Gold, Gold fingers |
Select the finish for assembly and storage needs. White mask reflectivity and thickness require a specified material and acceptance method.
Thermal, insulation & reliability
| Parameter | Specification | Application notes |
|---|---|---|
| Thermal conductivity (dielectric) | 1.0 鈥� 3.0 W/m路K standard, up to ~7 W/m路K | |
| Thermal resistance | Low 鈥� set by dielectric type & thickness | |
| Dielectric breakdown | 鈮� 3 kV (Hi-pot tested) | Material/test-condition dependent; define duration, electrodes and leakage/trip limits. |
| Peel strength | 鈮� 1.4 N/mm | Confirm laminate, copper, conditioning and test method. |
| Thermal shock | Solder float 288 鈩� / 10 sec | Confirm specimen, conditioning, cycles and acceptance method; not an operating-temperature rating. |
| Flammability | 94V-0 material / construction option | For the selected recognized material/construction; request the applicable UL file and thickness range. |
| Operating temperature | 鈭�40 鈩� to +140 鈩� (material dependent) | Select the actual laminate and component system; material-dependent range. |
Breakdown test voltage is not a working-voltage rating. Material conductivity, thermal resistance and operating temperature require grade-specific data and test conditions.
Engineering decisions before release
Direct thermal paths & multilayers
Show isolated conductors, any exposed sinkpad and the intended path into the heatsink. Thermal-via and multilayer arrangements need their own insulation review.
Thermal and high-current alternatives
Compare dielectric thickness, copper cross-section and cooling conditions before moving to another substrate family.
Continue with design or budget planning
Metal-core PCB manufacturing. Use the service-page tools for geometry or budget planning, or send your existing files directly for review.
Inspection evidence for your supplier review
Agree IPC-6012 for applicable rigid-board performance and IPC-A-600 for board acceptability, including revision, class and customer requirements. Request the relevant evidence against the part number and drawing revision.
help separate manufacturing requirements from acceptance criteria.
- Current ISO 9001 documentation and applicable UL file / construction scope for supplier qualification.
- Approved drawing, material identification, lot traceability and agreed inspection records.
- Dimensional, electrical-test and any specified coupon / microsection results.
Quality system and supplier documents 路 Inspection workflow 路 Equipment and process evidence
Metal-Core PCB capability questions
Is 7 W/m路K the conductivity of the complete PCB?
No. It is an advanced dielectric material option. The board-to-heatsink thermal path also includes dielectric thickness, copper spreading, contact area and interfaces.
Does a 3 kV breakdown value permit 3 kV continuous operation?
No. Operating insulation depends on the material system, spacing, environment and the applicable product requirements. Define the test method, duration and acceptance separately.
Why is line/space listed both generally and by copper weight?
Etching capability changes with copper and construction. The copper-dependent table preserves the earlier reference, while the general process table covers the broader material family. Confirm which route applies to your drawing.
Send the drawing. Define the build.
Send what you have. Mark any requirement where you need an engineering recommendation, and identify the current revision.
- Artwork, drill / machining drawing, board outline and quantity.
- Metal base grade and thickness; dielectric grade, thickness and W/m路K.
- Circuit copper, finish, clearance to metal and mounting-interface requirements.
- Thermal load and cooling arrangement, insulation test conditions and reports.
Ready for a manufacturability review?
Upload the files through Contact. The reply can define pricing, delivery, process exceptions and the agreed test scope.
Send files for an exact quote