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AOI for PCB and SMT assembly

Use automated optical inspection to check visible features against the correct program. Distinguish a machine call from a confirmed defect, and identify the hidden or functional conditions that need another method.

Share the product revision, required checks and expected records. Early questions are welcome.

SMT AOI inspection equipment
SMT AOI equipment shown on the 勛圖tv equipment page. Inspection coverage is defined for the actual assembly and program.

Can an AOI pass establish that the whole assembly works?

AOI evaluates programmed visible features. Its result depends on access, image quality, reference data and review rules. It does not demonstrate internal continuity, every hidden solder interface or product operation. Use reviewed calls and complementary tests to build an explicit coverage plan.

Review the evidence fields and engineering example

What is AOI for PCB〞and what changes for SMT?

Automated optical inspection, or AOI, uses controlled imaging and a programmed reference to identify features that need review. In bare PCB production, the inspection target is the manufactured conductor pattern. In SMT assembly, it is the population, orientation, placement and visible solder-joint appearance. These are related uses of optical measurement, but they require different source data, defect libraries and acceptance decisions.

For a buyer, ※AOI included§ is only the start of the conversation. Ask which process stages are inspected, which sides and component families are covered, how obscured features are handled, and what happens when the machine calls an anomaly. A machine call is a request for evaluation; it is not automatically a confirmed defect. A pass likewise applies to the programmed visible features, not every possible failure mechanism.

AOI for bare PCB versus AOI for SMT
ContextUseful observationComplementary evidence
Bare-board AOIConductor-pattern deviations such as visible gaps, excess copper or local geometry changesConnectivity against the released netlist; dimensional and construction checks
Pre-reflow SMT AOIMissing, shifted or rotated components where the program and visibility support the checkPaste measurement, placement review and subsequent solder inspection
Post-reflow SMT AOIVisible solder geometry, component presence, orientation and placementHidden-joint imaging, electrical measurements and product functions
Bare-board conductor geometry compared with SMT component and visible-joint inspection. Hidden interfaces require other evidence.
Bare-board conductor geometry compared with SMT component and visible-joint inspection. Hidden interfaces require other evidence.

Use bare PCB electrical testing to investigate electrical connectivity. For a complete assembly route, return to PCB Assembly services with the inspection scope attached to the build requirements.

Which defects can AOI find?

Missing components, visible polarity differences, lifted leads, skew, tombstoning and some solder bridges are useful AOI targets when the features are visible and the inspection recipe is appropriate. Marking recognition can support identification, but an unreadable or similar marking does not establish the exact component value or manufacturer part number. Electrical verification and sourcing traceability answer different questions.

Optics cannot inspect through an opaque package. A BGA array and the underside of a QFN may contain interfaces that are absent from the camera view. Tall components, reflective surfaces, shadows and board distortion can also restrict observation. Do not count an obscured area as inspected simply because the board passed through the machine.

A solder surface that looks unusual is not enough to diagnose its metallurgy or predict lifetime. Review lighting, focus, reference libraries and the physical assembly before assigning a cause. For hidden-joint questions, specify PCB X-ray inspection and an interpretation method. For operating behavior, define the relevant PCBA functional tests.

2D versus 3D AOI: choose from the inspection task

Choose optical technology from the feature and required evidence
Decision2D imaging3D measurement
Primary informationColor, contrast, texture and projected geometryAdds height or reconstructed surface geometry
Useful questionsPresence, orientation and visible feature comparisonCoplanarity, height and volume-related geometry where supported
Limitations to reviewLighting variation, reflective surfaces and occlusionOcclusion, reconstruction quality, calibration and component-dependent measurement limits
Selection evidenceTrial against representative acceptable and defective featuresMeasurement repeatability and demonstrated detection on the same representative features

※3D§ is not a guarantee that every joint is measurable. The illumination, camera access, algorithm and recipe still matter. A useful trial contains realistic variations: more than one accepted component appearance, board locations with different shadow conditions, and representative defects that reviewers can independently identify. Compare both the detection performance and the effort required to resolve calls.

For a mixed-technology board, the inspection route may change between SMT reflow and through-hole soldering. Treat each operation as a separate opportunity to verify the features affected by it. Preserve records that identify where the result was obtained, rather than reporting a single unexplained ※AOI OK§ for the whole manufacturing route.

From source data to a reviewed inspection result

Start with the released BOM, placement coordinates, assembly drawings, variant or DNP rules and the acceptance specification. Align these with the PCB revision and the actual assembly program. A correct inspection recipe for the previous revision can miss a deliberate change or generate unnecessary calls on the new one.

  1. Define the scope. Identify the process stage, sides, components and visible features to inspect. Record excluded or obscured features.
  2. Prepare and validate the recipe. Establish alignment references, component libraries, lighting and thresholds for the actual product.
  3. Inspect and classify calls. Preserve the location, image and machine reason; evaluate the call against the agreed criteria.
  4. Resolve and verify. Confirm defects, route authorized rework and re-inspect affected features using a controlled procedure.
  5. Review trends. Separate recurring real defects from nuisance calls and investigate changes in process or measurement conditions.

The step illustration is an explanation of the review loop, not a recording of production inspection. A good feedback loop improves the process without quietly relaxing the criteria to achieve a lower call count.

Bare PCB optical inspection equipment
Bare-board AOI equipment from the 勛圖tv fabrication equipment page; its inspection target differs from a populated assembly.

AOI review calculator: calls, false calls and escapes

This tool helps interpret an independently reviewed set of inspection opportunities. Enter true calls, false calls, escapes and true negatives from the same defined dataset. One opportunity might be one component feature or one inspection location; use that unit consistently. Do not mix board counts with solder-joint counts.

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AOI Review Metrics

Inspection Engineering
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Using this tool & sharing results

Use the stated units, input limits and model assumptions. Results support an engineering discussion; they do not approve a design, process or production order.

After changing inputs, update the result before using it. Where a download or copy action is available, review that brief and attach or paste it into your enquiry. Opening Contact does not transfer these inputs or send a request.

How to use and share tool results

Confusion matrix: true positives, false positives, false negatives and true negatives. Only independently labelled inspection opportunities support all four counts.
Confusion matrix: true positives, false positives, false negatives and true negatives. Only independently labelled inspection opportunities support all four counts.

Precision asks what proportion of called opportunities were actually defective. Recall asks what proportion of independently identified defects were called. False-positive rate uses acceptable opportunities as its denominator. Escapes among all inspected opportunities use a different denominator and should not be confused with the fraction of defects missed.

These values cannot be reconstructed from machine calls alone. Finding zero escapes in a small audit does not establish zero escapes in production. The tool therefore reports descriptive ratios and the entered sample size, without estimating factory reliability, assigning an IPC pass, or making a confidence claim unsupported by the sampling design.

IPC requirements: process control and acceptance are distinct

lists IPC-9716 for AOI process control of printed board assemblies. IPC-A-610 addresses assembly acceptability, while J-STD-001 addresses requirements for soldered assemblies. Apply the contractually specified revision, product class and relevant addenda; a generic reference to ※IPC standard§ is insufficient.

The directory marks IPC-9262, the older AOI equipment characterization document, as no longer maintained. This does not automatically cancel an existing contractual requirement. It does mean that an older reference should be reviewed deliberately instead of being presented as the current universal process-control standard.

Recipe validation, operator review, equipment condition and record control support the application of the acceptance requirements. None of the educational illustrations or calculator outputs on this page certifies an assembly. Where a disputed observation cannot be resolved optically, agree the additional method and the authority responsible for disposition.

What to request in an AOI scope and report

Provide the board and assembly revisions, quantity, sides, component variants, acceptance basis and the features that are especially important to your product. Identify hidden joints, tall neighboring parts, coating or other conditions that may change optical access. If an image archive or board-level traceability is required, request it in the quotation rather than assuming it is included.

A useful record connects the inspected unit or lot to the recipe revision, process stage, finding location, review outcome and rework disposition. It should make it possible to distinguish a machine alarm from a confirmed defect and a corrected defect from a feature accepted after review. Image retention and report granularity should match the agreed scope.

Before approving a repeat build, review changes in BOM, footprint, component appearance, panelization and recipe. The first-piece inspection procedure provides a practical point to reconcile those changes. Upstream solder paste inspection can provide additional context for printing-related trends.

For a broader comparison, use the inspection and test-method guide. To discuss project-specific records and supplier review, see 勛圖tv quality assurance or send your inspection requirements directly with the quotation files.

What to request in an AOI exception report

Use these fields to scope the report with your quotation. The table is a planning example, not a 勛圖tv test result or a promise that every record is included by default.

Report review fields
Record itemInformation to includeWhy it matters
Inspection identityBoard revision, side, program revision and lot or serial IDPre-reflow and post-reflow results refer to different process states.
LocationReference designator or feature, image and reported conditionPreserve enough context to find the same feature on the board.
Review outcomeConfirmed defect, acceptable condition or further reviewDo not treat all machine calls as actual defects.
Follow-upDisposition, authorized correction and reinspection resultTrack a repeat call without deleting the first observation.
Walk through an engineering example

Illustrative review: a low-contrast marking triggers a polarity call. The reviewer checks the approved part marking and assembly orientation before classifying the call. If the marking cannot establish orientation, use the approved alternate verification route. Reducing program sensitivity simply to suppress the call can also hide real defects.

Continue to review hidden-joint inspection when optical access is insufficient.

The email link opens a draft for you to complete. Contact is a separate form; these pages do not send messages automatically.

Questions engineers and buyers ask

Does AOI prove that every solder joint is good?

No. AOI evaluates the programmed visible features. Hidden interfaces, electrical performance and reliability mechanisms require their own evidence and agreed acceptance criteria.

Can AOI verify resistor or capacitor values?

Appearance and marking checks may support identification, but they do not universally verify electrical values. Use the BOM, sourcing records and an appropriate electrical test where required.

Is 3D AOI the same as SPI?

No. They can use related measurement technology, but SPI evaluates printed paste before placement, while assembly AOI evaluates components and visible assembly features at defined stages.

Can I send photographs for an AOI diagnosis?

Photographs can help explain a concern. They do not recreate the machine recipe, illumination, scale, viewing access or independent defect verification needed for a full inspection decision.

Turn the inspection question into an agreed scope

Send the current files, product revision, quantity and the requirements that matter to your application. Identify any unfinished criteria so the engineering review can address them explicitly.

Request the method, coverage, acceptance basis and report format with your quotation. Tool briefs can support the discussion; the Contact form does not automatically receive this page*s entered data.

Engineering references reviewed September 2026. Illustrations explain methods; equipment photographs do not establish product-specific coverage, inspection results or certification.