Controlled impedance
Send the target, tolerance, signal layer and reference planes before freezing trace widths. Agree a coupon and TDR report with the stackup.
吃瓜tv / Manufacturing specifications
Rigid PCB Manufacturing Capabilities
Compare production and prototype limits for multilayer boards, copper, holes, surface finish and controlled impedance.
- Production layers
- 1鈥�24
- Prototype layers 路 review
- Up to 78
- Minimum line / space
- 3 mil
- Production / advanced impedance
- 卤10% / 卤7%
Full process capability tables
Use the matching construction and production window. Dimensions, copper and via limits must be reviewed together; an extended capability is confirmed against the released drawing.
Capability tables (CSV)For a project-specific check: identify which production column you are using, the finished-versus-tool dimension, and the other limits used on that same construction. Send those marked rows with the manufacturing review. A table revision is not a substitute for written acceptance of a proposed stackup.
Layers & board dimensions
| Parameter | Mass production | Prototype / extended review | Application notes |
|---|---|---|---|
| Layer count | 1鈥�24 layers | 1鈥�78 layers | Review material system, stackup, hole spans and finished thickness together; the maximum is not a universal construction. |
| Max. panel size | 600 脳 770 mm (23.62鈥� 脳 30.31鈥�) | 600 脳 770 mm & 500 脳 1200 mm (19.69鈥� 脳 47.24鈥�) | Review finished-board array, process borders and usable panel area. |
| Max. board thickness | 8.5 mm | 8.5 mm | Confirm with layer stackup and the drilling/plating window; do not combine with a separate minimum hole entry. |
| Min. board thickness | 2L: 0.3 mm 路 4L: 0.4 mm 路 6L: 0.8 mm | 2L: 0.1 mm 路 4L: 0.3 mm 路 6L: 0.6 mm | Confirm handling, panel support, copper balance and the exact layer construction. |
Prototype limits are a separate process window. The 8.5 mm maximum thickness and the smallest hole are not a supported combined specification.
Conductor width & spacing
| Parameter | Mass production | Prototype / extended review |
|---|---|---|
| Min. inner-layer clearance | 3 mil | 3 mil |
| Min. line width | 3 mil (0.0762 mm) | 3 mil (0.0762 mm) |
| Min. line space | 3 mil (0.0762 mm) | 3 mil (0.0762 mm) |
Conductor limits depend on copper weight, layer and local pattern density. Quote the tightest geometry on each layer.
Drilling, vias & hole plating
| Parameter | Mass production | Prototype / extended review | Application notes |
|---|---|---|---|
| Min. hole size | 0.1 mm | 0.1 mm | Confirm drilling vs finished diameter, hole depth and material. |
| Min. plated hole copper | 25 碌m | 25 碌m | Plated-through-hole reference; specify average/local minimum and acceptance class. |
| Min. blind / buried via | 0.1 mm | 0.1 mm (1鈥�18 layers) | Define layer span, depth and opening diameter; confirm the complete via map. |
| PTH dia. tolerance | 卤0.076 mm (鈮埪�3 mil) | 卤0.076 mm (鈮埪�3 mil) | State the finished plated-hole diameter and fit requirement on the released drawing. |
| NPTH dia. tolerance | 卤0.05 mm (鈮埪�2 mil) | 卤0.05 mm (鈮埪�2 mil) | Identify non-plated mechanical holes and the required finished diameter. |
| Hole position deviation | 卤0.05 mm (鈮埪�2 mil) | 卤0.05 mm (鈮埪�2 mil) | Dimension the datum and feature location to make the positional requirement inspectable. |
Define whether a diameter refers to a drill tool, finished plated hole or laser opening. The 0.1 mm entry needs a hole-specific process review.
Copper, solder mask & marking
| Parameter | Mass production | Prototype / extended review | Application notes |
|---|---|---|---|
| Heavy copper | 4 oz (nominal 鈮�140 碌m) | up to 12 oz | Review copper with line/space and construction; do not combine independent minima. |
| Min. solder-mask bridge | 0.1 mm (鈮�4 mil) | 0.1 mm (鈮�4 mil) | Review mask colour, pad spacing and registration together. |
| Solder-mask colour | Green, Black, Blue, White, Yellow, Red | Green, Black, Blue, White, Yellow, Red | |
| Silkscreen colour | White, Yellow, Red, Black | White, Yellow, Red, Black | |
| Peelable mask | Top, bottom, double-sided | Top, bottom, double-sided |
Heavy copper requires wider line and space. Solder-mask bridge capability also depends on colour and pad geometry.
Profile & mechanical processing
| Parameter | Mass production | Prototype / extended review |
|---|---|---|
| Outline method | Routing, V-groove, beveling, punch | Routing, V-groove, beveling, punch |
| Outline tolerance | 卤0.15 mm (鈮埪�6 mil) | 卤0.15 mm (鈮埪�6 mil) |
Dimension the finished profile and any bevel, score depth or edge plating on the fabrication drawing.
Electrical & reliability requirements
| Parameter | Mass production | Prototype / extended review | Application notes |
|---|---|---|---|
| Controlled impedance | 卤10% | 卤7% | Agree signal/reference layers, geometry, coupon and test method. |
| Insulation resistance | 1 脳 10鹿虏 惟 (normal) | 1 脳 10鹿虏 惟 (normal) | Confirm temperature, humidity, conditioning and test voltage. |
| Through-hole resistance | Per approved continuity test plan | Per approved continuity test plan | Continuity threshold and unit must be specified in the electrical-test plan. |
| Thermal shock | 3 脳 10 sec @ 288 鈩� | 3 脳 10 sec @ 288 鈩� | Confirm specimen, conditioning, cycles and acceptance method; not an operating-temperature rating. |
| Warp & twist | 鈮� 0.7% | 鈮� 0.7% | Define the panel/board condition and measurement method. |
| Electric strength | > 1.3 kV/mm | > 1.4 kV/mm | Material test reference; confirm test method and dielectric construction. |
| Peel strength | 1.4 N/mm | 1.4 N/mm | Confirm laminate, copper, conditioning and test method. |
| Solder-mask hardness reference | > 6H | > 6H | Reference >6H; specify the hardness test method. Do not interpret this as an abrasion-life rating. |
| Flammability | 94V-0 material / construction option | 94V-0 material / construction option | For the selected recognized material/construction; request the applicable UL file and thickness range. |
| Test voltage | 50鈥�330 V | 50鈥�330 V | Electrical-test setting; not rated operating voltage. |
Electrical and reliability values require an agreed method, specimen and acceptance plan. Test voltage is not a continuous operating-voltage rating.
Materials & surface finishes
FR-4, high-Tg, halogen-free, low-loss and RF laminates are selected by grade and construction. Finish options include HASL / lead-free HASL, ENIG, ENEPIG, OSP, immersion silver / tin, and electrolytic hard gold / gold fingers.
State the finish and required thickness or specification on the drawing. Material ratings and finish acceptance apply to the selected construction.
Engineering decisions before release
HDI, via-in-pad & back drilling
Identify via spans, filling, capping and maximum residual stub. Select the process from the actual connection geometry.
Heavy copper & thermal paths
Define starting and finished copper separately. Review plating distribution, resin fill and fine features in the same construction.
Continue with design or budget planning
PCB manufacturing services and budget planning. Use the service-page tools for geometry or budget planning, or send your existing files directly for review.
Inspection evidence for your supplier review
Agree IPC-6012 for applicable rigid-board performance and IPC-A-600 for board acceptability, including revision, class and customer requirements. Request the relevant evidence against the part number and drawing revision.
help separate manufacturing requirements from acceptance criteria.
- Current ISO 9001 documentation and applicable UL file / construction scope for supplier qualification.
- Approved drawing, material identification, lot traceability and agreed inspection records.
- Dimensional, electrical-test and any specified coupon / microsection results.
Quality system and supplier documents 路 Inspection workflow 路 Equipment and process evidence
Rigid PCB capability questions
Can the smallest hole be used in the thickest board?
No single table entry approves that combination. Hole depth, diameter, plating and the full stackup determine the process route. Identify the hole type and layer span for review.
Does prototype capability mean the same geometry is ready for volume?
The prototype column describes the extended review window. A volume release needs an agreed stackup, inspection plan and repeatable process for the specific design.
Can I specify 12 oz copper with 3 mil traces?
Treat these as separate limits. State copper on each layer and identify fine features so engineering can confirm the achievable combination.
Send the drawing. Define the build.
Send what you have. Mark any requirement where you need an engineering recommendation, and identify the current revision.
- Gerber / ODB++ data, NC drill and fabrication drawing with revision.
- Layer stack, material grade, board thickness and copper per layer.
- Critical holes, line / space, impedance targets, finish and quantity.
- Required IPC class, report scope and any drawing exceptions.
Ready for a manufacturability review?
Upload the files through Contact. The reply can define pricing, delivery, process exceptions and the agreed test scope.
Send files for an exact quote