RF core construction
For a comparatively simple RF stack, identify the dielectric height beneath each controlled trace and the copper foil. Finished board thickness alone cannot define the impedance model.
Review RO4350B constructionRogers PCB Manufacturing
Choose the laminate, check your RF geometry and prepare a fabrication quote. Start with your material requirement or compare practical alternatives below.
RO4000庐 路 RO3000庐 路 RT/duroid庐 | Material, foil and stackup confirmed during project review
Design & Estimate Your Rogers PCB
Compare materials. Check a trace. Build a clear quote request.
| Compare / material | Process Dk | Design Dk | Typical Df | Next step |
|---|---|---|---|---|
| 3.48 卤 0.05 | 3.66 | 0.0037 | Grade details | |
| 3.38 卤 0.05 | 3.55 | 0.0027 | Grade details | |
| 3.00 卤 0.04 | 3.16 | 0.0010 | Grade details | |
| 2.20 卤 0.02 | 2.20 | 0.0009 | Grade details | |
| 3.48 卤 0.05 | 3.66 | 0.0037 | ||
| 6.15 卤 0.15 | 6.4 | 0.002 | Grade details | |
| 10.20 卤 0.30 | 11.2 | 0.0022 | Grade details | |
| 2.33 卤 0.02 | 2.33 | 0.0012 | Grade details |
Choose 2 or 3 materials for a side-by-side calculation.
Dk values are not interchangeable. Process Dk describes a test method; Design Dk is a circuit-model reference. Your calculation uses the editable Model Dk. Typical Df values are reference measurements, not guaranteed loss at every frequency.
RO3003 Design Dk 3.16 uses a 77 GHz differential-phase reference. RO4350B 4 mil process Dk has a different specification. Confirm thickness, test method, frequency and foil before release.
Compare RO4350B with RO4003CCompare RO3003 with RO4350B
Data checked 16 October 2026: . Selection is a comparison aid, not a qualification or availability guarantee.
Microstrip reference geometry 路 schematic, not to scale. The model assumes zero copper thickness and air above the trace.
Enter your assumptions and calculate.
Use these results for a design discussion. Models are quasi-static and omit copper thickness, mask, roughness and dispersion. Loss is dielectric-only, not total insertion loss. Final geometry needs the released stackup and an appropriate field solver. Review controlled-impedance requirements.
Prepare the fabrication scope
Use your board requirements for a quote brief. If you have confirmed cost allowances, you can also calculate a transparent planning total.
No price calculated. Material and process pricing require a reviewed quotation.
Model Dk does not set material pricing. Hybrid, metal-backed, more than 4 layers or unconfirmed constructions go to engineering review. Shipping, tax and any unentered costs are excluded.
Match the construction to the RF task
A material name alone does not define the board. Start with where the RF signals travel, then agree the dielectric, copper and fabrication requirements around them.
RF / FR-4 hybrid
Use RF laminate where the circuit needs it. Agree the bonding system, cured thicknesses, symmetry and drilling requirements before comparing a hybrid quotation. Review RF multilayer stackup planning.
Explore RO4003C requirementsLow-Dk or compact RF circuits
Lower Dk and higher Dk serve different geometry goals. Compare trace dimensions and phase at a common reference structure; neither Dk nor Df alone establishes the best material.
Review RT/duroid 5880If the material family is still open, compare RO4000 core and bonding-material roles or RO3000 grade and construction trade-offs before fixing the laminate designation in your drawing.
Define what must survive fabrication
- RF geometry: controlled layers, reference planes, impedance targets and coupon requirements.
- Material identity: complete grade, core thickness, foil type and approved substitution policy.
- Mechanical detail: outline tolerances, slots, cavities, edge features and connector interfaces.
- Thermal path: agree metal backing, bonding and flatness where required.
Need millimetre-wave material context? Review RO3003 design assumptions before releasing the stackup.
Compare the quote scope, not just the laminate price
Two quotations are comparable only when the construction, inspection and delivery requirements match. For a deeper cost discussion, see Rogers PCB pricing factors.
| Cost or schedule driver | What to specify | Useful decision |
|---|---|---|
| Material and foil | Full grade, thickness, copper type and acceptable alternatives | Confirm available construction before committing the layout. |
| Panel use | Outline, orientation, rails, coupons and required delivered quantity | Review nesting without assuming every panel position becomes a good board. |
| Stackup and processing | RF core or hybrid, layer count, bonding, drilling and special features | Compare the complete fabrication route; simple area multipliers can miss shared setup work. |
| Acceptance and records | Electrical test, impedance coupon, RF measurement if needed, report requirements | Agree coverage and limits before production. |
| Delivery | Required date, file readiness and material approval milestones | Confirm feasibility for the actual order; a web-page estimate is not a delivery promise. |
Specify the evidence your circuit needs
Material traceability, electrical continuity and RF performance answer different questions. Ask for the records that correspond to your acceptance criteria. Use the quality assurance review to define your required evidence.
| Requirement | Request with the RFQ | What it does not establish |
|---|---|---|
| Material identity | Agreed material designation and applicable lot documentation | A board photo does not verify laminate grade or traceability. |
| Connectivity | Electrical test coverage against the released netlist | Continuity testing does not demonstrate insertion loss or return loss. |
| Controlled impedance | Coupon geometry, targets, acceptance limits and reporting method | A coupon is not a measurement of every RF transition. |
| RF behaviour | Frequency range, fixtures, reference planes and measurement criteria | A nominal material Df does not guarantee assembled circuit performance. |
Include component assembly in your requestExplore the wider RF PCB material route
Send a reviewable Rogers PCB enquiry
You can ask for material advice before every detail is fixed. Separate confirmed requirements from open questions. For an early build, specify the prototype fabrication scope and what the first boards must verify.
| Design files | Fabrication data, drill files, outline and drawing; include the released revision. |
|---|---|
| Construction | Stackup, preferred grade and foil, finished thickness and controlled impedance notes. |
| Order scope | Quantity, requested date, finish, inspection and reporting requirements. |
| Open decisions | Identify unconfirmed material, impedance geometry or acceptable alternatives. Attach the workbench brief if useful. |
Can you quote if my Rogers material is not selected yet?
Submit the operating frequency, circuit constraints, proposed stackup and priority trade-offs. Ask for options to review; a substitute should be approved against your design requirements, not chosen only by nominal Dk.
Can I replace RO4003C with RO4350B without changing the layout?
Do not assume a direct swap. Compare the relevant Design Dk, dielectric thickness and foil, then recheck impedance, phase and the required material qualifications. The workbench helps reveal geometry sensitivity; it does not approve substitution.
Does lower Df always mean the lowest circuit loss?
No. Conductor roughness, trace geometry, frequency, connectors and transitions also contribute. Use dielectric-only calculations for a limited comparison, then review the full structure.
Will the tool give a firm price?
No. Optional totals use your own confirmed allowances. Material supply, process details and acceptance requirements still need review. Contact provides the route to a project-specific quote.
Ready to review your Rogers PCB build?
Share your files, preferred laminate and required quantity. Include any open material or stackup questions in the same request.
Request a Quote