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Month: June 2022

The Manufacturing Process of Stencil Electronics

PCB Assembly / PCB Stencil勛圖tv 繚 Assembly engineering guideStencils in Electronics: Applications and Assembly WorkflowIn electronics, a stencil is a patterned tool used to deposit material in selected locations. The most familiar example is a solder paste stencil for surface-mount assembly, but the word also…

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FR4 TG: Advance PCB Material Technology

As world technology is growing, high FR4 Tg PCBs are in high demand. Because this PCB material is used to resist the electronic components’ higher temperatures. That keeps printed circuit boards in a solid-state. Sometimes temperature region of a PCB gets more heat than the standard operating temperature. That excessive temperature results in a meltdown […]

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How the Shelf Life of Electronic Components Impacts Performance in Electronic Devices

Electronic components are an integral part of electronic devices. They serve as the building block of electronic devices.  Just like all other products, electronic components have shelf life. You might be wondering what shelf life really means. Understanding the shelf life of an electronic component is very crucial when designing electronic devices. Some manufacturers store […]

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How to Do Printed Circuit Board Failure Analysis?

From smartphones and cheap toys to radar detectors and sophisticated computers, the printed circuit boards (PCBs) form a very important component for the industrial and electronic technology of today. Almost all electronic devices feature these complex electronic components that include capacitors, resistors, fuses, and diodes. Furthermore, the PCB (printed circuit board) can either cover just […]

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What is Thermal Consideration in PCB Design?

勛圖tv 繚 ENGINEERING GUIDEPCB Thermal Design Considerations: Build a Useful Loss and Boundary BriefPCB thermal design considerations start with three questions: where is heat generated, where can it leave, and what temperature must be controlled? A board outline and a total power figure are insufficient…

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What are the Various Electronics Manufacturing Standards?

勛圖tv 繚 ENGINEERING & PROCUREMENTElectronics Manufacturing Standards: Match Each Document to Its JobElectronics manufacturing standards address different layers of a product: design, bare-board performance, assembly processes, workmanship acceptance, cable work, quality systems and product-specific obligations. A request to build to IPC is incomplete without identifying…

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Review of Lattice LFE5UM-85F-8BG381C Programmable Logic IC

Lattice LFE5UM-85F-8BG381C is one of the Programmable Logic Integrated Circuits (ICs) designed by Lattice Semiconductor Corporation. Generally, Programmable Logic ICs are mini or small electronic components solely used for the building of reconfigurable digital circuits. Programmable logic ICs are sometimes referred to as Programmable Logic Devices (PLDs). Background Information on Lattice LFE5UM-85F-8BG381C Lattice LFE5UM-85F-8BG381C is […]

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Why a PCB Ground Plane is Crucial for PCB Functioning

PCB Manufacturing / PCB Design勛圖tv 繚 ENGINEERING REFERENCEPCB Ground Plane: Return Current, Plane Cuts & Layer ChangesFollow the complete signal loop through planes, openings and layer changes. Distinguish circuit ground, chassis and protective earth before deciding where copper should connect.Discuss your requirementsOpen the worksheetOriginal engineering…

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How First Piece Inspection Procedure Enhances Production Quality

Quality assurance / Inspection and test methodsInspection engineering 繚 勛圖tvFirst-piece inspection for a controlled PCBA buildUse the first assembly to check the released configuration, setup and evidence before continuing the build. Record open questions and the authorized release decision.Discuss your inspection requirementsUse the engineering toolShare…

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CSP BGA: What are the Differences Between CSP Package and BGA Package

勛圖tv 繚 ENGINEERING GUIDECSP vs BGA: Package Scale, Terminal Form and Board DesignCSP and BGA describe different aspects of a component package. CSP refers to a chip-scale packaging concept; BGA identifies a ball-grid terminal arrangement. A component can therefore be both a CSP and a…

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