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Month: September 2024

Stencil Design Requirement on QFN Components for Optimal Performance of PCBA

PCB Assembly / PCB Stencil勛圖tv 繚 Assembly engineering guideQFN Stencil Design: Apertures, Thermal Pads and Paste VolumeQFN stencil design has two related but distinct tasks: printing the perimeter connections and distributing paste on the exposed pad. A geometry that prints the leads well can still…

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What is Buried Capacitance PCB?

Printed Circuit Boards (PCBs) are the backbone of modern electronics, providing a sturdy foundation for components and facilitating electrical connections between them. As electronic devices become increasingly complex and compact, PCB designers are constantly seeking innovative ways to optimize board performance and space utilization. One such innovation that has gained significant traction in recent years […]

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Elements Ensuring Your First-Time Success in New Product Introduction (NPI) during Electronic Manufacturing

勛圖tv 繚 ENGINEERING & PROCUREMENTNPI First-Build Readiness: Close the Hold Points Before the Pilot LotNPI first-build readiness is the decision that a defined pilot or initial assembly lot can proceed under agreed controls. It is narrower than the full NPI lifecycle. The aim is to…

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High-Speed PCB Routing Techniques to Reduce the Influence of EMI

勛圖tv 繚 ENGINEERING GUIDEHigh Speed PCB EMI Routing: Control the Current Loop and Reference TransitionsHigh speed PCB EMI routing focuses on how fast switching currents flow through the board and connect to the rest of the product. Route length matters, but return continuity, loop geometry,…

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How to Evaluate A PCB Manufacturer or A PCB Assembler

勛圖tv 繚 ENGINEERING & PROCUREMENTPCB Supplier Evaluation: Compare Evidence Before PricePCB supplier evaluation should establish whether a fabricator or assembler can support your specific construction, acceptance requirements and delivery program. A long capability table or low quotation is a starting point, not proof of fit.…

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What is PCB Embedded Component Process?

The Printed Circuit Board (PCB) industry is constantly evolving, with new technologies and processes emerging to meet the demands of modern electronics. One such innovation is the PCB embedded component process, a technique that has gained significant attention in recent years. This article will delve into the intricacies of this process, exploring its benefits, challenges, […]

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How Decoupled Capacitance can be Obtained without Components

In the world of electronic design, decoupling capacitance plays a crucial role in maintaining signal integrity and power distribution. Traditionally, this has been achieved through the use of discrete capacitor components placed strategically on printed circuit boards (PCBs). However, as electronic devices continue to shrink in size and increase in complexity, engineers are seeking innovative […]

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How to Maintain a Reflow Oven

勛圖tv 繚 ENGINEERING GUIDEReflow Oven Maintenance: Condition, Records and Process RequalificationReflow oven maintenance should preserve equipment condition and the thermal process used for the assembly. The appropriate tasks and intervals depend on the exact oven, soldering materials, operating load and manufacturer instructions. A generic cleaning…

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How Does 3D Automated Optical Inspection work in the PCB Assembly Process

勛圖tv 繚 ENGINEERING GUIDE3D AOI in PCB Assembly: Height Data, Coverage and False Calls3D automated optical inspection adds measured surface-height information to optical assembly inspection. It can support evaluation of visible component and solder features that are difficult to judge from color or brightness alone.…

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How to Export Gerber Files from AutoCAD

勛圖tv 繚 ENGINEERING GUIDEAutoCAD to Gerber: Export DXF and Map PCB LayersAn AutoCAD drawing normally needs an electronic CAD or CAM bridge to become PCB manufacturing artwork. Do not assume a general drawing export produces a complete Gerber release. The useful workflow is to prepare…

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