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NP-155FBH: a documented laminate construction, not an application guarantee

Nan Ya NP-155FBH is a glass-reinforced epoxy copper-clad laminate. Its current technical sheet describes a Dicy-free material compatible with lead-free processing and identifies CAF resistance among its features. That does not, by itself, approve an automotive module, define a safe operating voltage or establish the finished board鈥檚 lifetime.

This page focuses on the exact NP-155FBH grade and its construction planning. The related prepreg identified in the reviewed document is NP-155FBHB. Keep that full name in the stack record. Do not shorten it to a similar base grade or infer the product chemistry by decoding individual suffix letters without manufacturer evidence.

If you are still choosing within the brand, use the Nan Ya materials guide. If the requirement points toward a different thermal profile or a dedicated CAF discussion, compare the NP-175FBH page with the same project assumptions.

Read the selected NP-155FBH values in context

The has a laminate performance page revised October 27, 2025. The nominal reference specimen is 0.062 inch, 1/1 copper. The document distinguishes typical values from specification limits; do not copy one column as if it were the other.

These values help frame an engineering review. They are not measured results for your board and should not be converted into a universal thermal or voltage rating. Retain the source, the exact grade and its revision when sharing the table with procurement or a fabricator.

A data-sheet thermal feature also does not specify every permissible assembly profile. Peak temperature, time, rework, moisture state and the fabricated construction need to be considered. The product should be assessed against its own requirements rather than a broad statement that all 鈥渁utomotive FR-4鈥� behaves alike.

Why NP-155FBHB needs its own line in the stack

A laminate core and its bonding material perform different roles in manufacture. The core arrives cured and dimensionally defined under its thickness convention. The prepreg flows and cures between patterned layers. Its pressed thickness is tied to resin content, glass construction, copper coverage and process conditions.

The reviewed prepreg page is revised October 11, 2024 and states a retained-copper context of 70鈥�80% for its nominal reference values. That footnote matters. A table entry should not be applied unchanged to a region with substantially different resin demand or to another resin system using the same glass style.

For a quotation, identify the requested bondline target and the surrounding copper distribution. Ask the fabricator to propose a construction that meets the intended dielectric and mechanical requirements. A ply count chosen solely to make the overall board thickness add up can overlook local filling and impedance consequences.

Explore a pressed-ply stack before requesting the final construction

The worksheet provides four reference glass styles from the NP-155FBHB table, or allows project pressed data. It adds identical plies to estimate nominal total thickness and a worst-case arithmetic interval. The comparison with your entered target is a planning aid, not a press recipe or a manufacturing tolerance promise.

Reference mode explicitly uses the supplier鈥檚 retained-copper context. The project thickness fields are used only in project mode. Select that mode when you have applicable pressed data for your actual construction. Keep the source and copper context in the brief so a later reviewer can see which basis produced the result.

The illustrative two-ply example shows why a nominal total and a tolerance interval should both be visible. Adding two per-ply tolerances arithmetically gives a conservative sum under the model; it does not establish a statistical process distribution or predict production yield. Resin flow, local pattern density and the press cycle are not solved.

If the calculated interval overlaps a critical mechanical or electrical limit, resolve the stack with the fabricator. Do not merely reduce the entered tolerance until the worksheet looks acceptable. The tool records assumptions; it cannot make an unsupported construction feasible.

Connect bondline planning to the electrical and mechanical design

Start with the signal reference structure and required finished thickness. Identify which dielectric spacings are critical and which dimensions can change. This helps the stack proposal preserve the right requirements instead of adjusting every layer indiscriminately.

For a controlled-impedance layer, use the final pressed construction and a suitable electrical model. The laminate鈥檚 catalogue Dk range is not automatically the design value of every prepreg layer. The PCB impedance page explains the separate geometry and verification task. Keep the impedance target and allowed tolerance in the fabrication drawing.

Copper distribution deserves attention across the panel as well as within one board. Large etched regions and dense copper regions can create different local resin demands. The fabricator needs artwork, not just a layer count, to assess the construction. If the panel includes coupons or rails, include them in the manufacturing conversation.

Drilling and hole-wall preparation also depend on the actual stack. A proposed small hole through a thick construction needs more than a material feature labelled 鈥渢hrough-hole reliability.鈥� Define hole types, drilled depths and finished requirements, then agree the relevant process and inspection evidence.

Automotive and industrial use begins with requirements

An automotive control unit, sensor interface or industrial controller may have very different thermal, humidity and electrical conditions. The material selection should be tied to the intended installation and customer requirements. Do not assume that every cabin application is easy or that every under-hood application is solved by a higher Tg.

CAF resistance is a material feature that requires a specific test context when used as evidence. Ask about coupon geometry, glass orientation, bias, temperature, humidity, duration and failure criteria. A test voltage does not become an allowable operating voltage, and a material report does not replace the product鈥檚 insulation design.

Qualification should identify the evaluated stack and processing route. If a repeat order changes the bonding material, foil or construction, review whether the earlier evidence still applies. The same principle applies when procurement proposes a similar suffix because it is easier to obtain. An approved alternate needs a defined approval record.

Specify what should accompany the delivered boards

Ask for the material identity and traceability needed by the project, together with the agreed finished-board inspection and test records. A material certificate, an electrical test result and a reliability report cover different parts of the evidence chain. Avoid asking for a vague 鈥渁utomotive certificate鈥� when the intended document is a specific material or process record.

A first-build review can resolve unclear thickness conventions, copper definitions and special test scope. The most useful engineering response is a marked-up proposal showing assumptions and open questions. Once agreed, keep that version with the fabrication release so later quotations describe the same construction.

If there is an acceptance requirement beyond routine board testing, identify its method and sampling basis before ordering. A generic laminate feature should not be substituted for a promised board-level test. Equally, avoid adding tests without defining what decision their results will support.

Estimate only against a defined NP-155FBH scope

Specify NP-155FBH core, the proposed NP-155FBHB bonding construction, finished thickness, copper, quantity, surface finish and tests. The cost impact can come from material purchasing, panel use, process complexity and verification. It cannot be inferred reliably from the grade number alone.

The budget worksheet separates a documented per-board allowance from setup and batch verification. It supplies no market rates. A special construction trial or requested reliability coupon should have its own agreed scope; do not assume it is included in a standard bare-board allowance. Keep assembly, freight and taxes explicit.

An RFQ with no cost values is valid. Leave all three allowances blank and download the technical record, or go directly to PCB manufacturing and Contact. The worksheet does not transmit your data, upload design files or automatically populate the receiving form.

When scope changes, the old costs are cleared. This prevents a previous estimate for a different stack or quantity being presented as current. A new quotation should state its basis and validity rather than relying on a calculator total with unsupported precision.

NP-155FBH construction questions