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Read the internal document title

The reviewed official chart lists NP-175FM. A separately indexed manufacturer PDF with NP-175FM in its URL identifies NP-175FMR inside the document. This discrepancy must remain visible; it is not permission to copy the FMR thermal and electrical table under an FM heading.

Request the exact current sheet for the offered supply and a written explanation if the suffixes are related. Preserve revision, supplied form and construction. The NP-175F thermal guide covers another distinct name, not a generic source for every 175 variant.

Material facts and decision boundaries

Use chart values as characterization context

The current Nan Ya chart gives Dk 3.63 and Df 0.0140 at 10 GHz for NP-175FM on its stated 70% resin-content basis. A different glass style or resin fraction may need a different design input. Retain the exact conditions before using a value in a field solver.

Do not compare a 1 GHz value from one specimen with a 10 GHz value from another as though only the material name changed. Frequency, conditioning and method can explain differences that a simple product ranking conceals.

Isolate dielectric attenuation without overclaiming

The worksheet accepts frequency, Dk, Df and uniform path length for a small-loss homogeneous TEM approximation. It estimates the dielectric contribution only. It does not include copper resistance, roughness, plated surfaces, vias or connectors.

The example inputs are hypothetical and are not preloaded as NP-175FM specifications. A full channel model needs the actual line geometry and additional loss mechanisms. The tool is useful for sensitivity and unit checks, not for qualifying an interface.

Compare a lower-loss candidate on matching conditions

The NPG-170D guide owns a separate lower-loss construction discussion. If it is a candidate, compare the same electrical boundary, copper assumptions and test method. A lower chart Df does not directly establish the finished route's improvement in dB.

Ask for available dielectric thicknesses, reinforcement and copper choices. The final stackup can change line width, tolerance and conductor loss, so an equal nominal impedance does not guarantee equal attenuation.

Homogeneous TEM dielectric loss illustration

Optional cost comparison from your own allowances

Use a quotation or a clearly labeled internal assumption for each input. Keep the quantity, construction and inspection scope the same when comparing alternatives. This uncalibrated planning model adds entered values; it contains no current market rates and does not issue a 吃瓜tv quotation. You can contact the team without completing it.

Keep assembly suitability in the same proposal

An electrical comparison still needs the board's thermal history, hole architecture and required manufacturing evidence. A material chosen for loss must also fit the intended build and assembly process.

The NP-155F assembly review addresses those thermal and geometric questions for another product. It is not an FM processing specification. Any alternative should be reviewed against the actual construction rather than a general lead-free label.

Send both the design requirement and source question

Provide the exact NP-175FM callout, the FM/FMR discrepancy if relevant, source revisions, stackup, operating frequency, dimensions and quantity. State copper, finish, critical routing and required tests. Identify which alternatives may be proposed.

The optional cost model uses user-entered allowances only. Keep quantity and evidence scope equal across offers. A useful response resolves the material identity and construction before treating the numerical comparison as a purchasing decision.

Tie the exact grade to an electrical construction

State the channel reference planes, frequency range, routing length, copper construction, transitions and interface assumptions together. A laminate loss-tangent value is one input to that system. It is not a complete insertion-loss measurement or a guarantee that a data rate will work.

Use comparable measurement or modeling conditions when screening alternatives. Material changes can require geometry changes to preserve impedance, and copper roughness can alter the result independently of the resin system. Keep the proposed stackup and the channel analysis synchronized through fabrication review.

For procurement, identify the properties that are fixed and the alternatives that can be evaluated. Request evidence at the relevant construction and frequency rather than a broad low-loss label. Compare total delivered scope and validation effort alongside material price. A shorter or better-routed channel may change the tradeoff more than replacing a material name alone.

A useful design-data record retains both the material value and the reason it was selected. State whether the value is supplier characterization, a construction-specific design input, a measured coupon extraction or an early assumption. These sources are not interchangeable. Keep frequency, method and specimen information visible when a comparison uses more than one document.

The tool on this page starts empty because a plausible default can otherwise be mistaken for a verified grade profile. Use the example to understand the units, then replace it with project inputs. A result with many decimal places does not imply that the material or routing-loss input is known to that precision.

For a high-speed design, plan how the model will be checked. Reference planes, coupon geometry, fixtures and the acceptance boundary determine what a measurement means. A coupon that characterizes one line construction does not automatically qualify every route or transition on the board.

Keep the commercial comparison aligned with the engineering one. Quantity, copper, layer structure, test deliverables and qualification effort should be comparable. A lower material allowance can be irrelevant if the proposed construction cannot meet the channel requirement, while a premium grade may be unnecessary if the actual route already has sufficient validated margin.